Compact Modeling of Thin-Film Transistors for Flexible Hybrid IoT Design

Leilai Shao,Ting Lei,Tsung-Ching Huang,Sicheng Li,Ta-Ya Chu,Man Wong,Raymond Beausoleil,Zhenan Bao,Kwang-Ting Cheng
DOI: https://doi.org/10.1109/mdat.2019.2899058
2019-01-01
Abstract:Editor’s note: Thin-film transistors can be manufactured at low cost and on flexible materials using printing technologies. These characteristics make them very well suited to many IoT applications, particularly wearable electronics. However, circuit and system designers require device models for these new devices. This article describes a SPICE-compatible compact model for a range of thin-film transistors. The authors have validated the models on three thin-film transistor technologies. —Dimitrios Serpanos, University of Patras —Marilyn Wolf, Georgia Institute of Technology
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