Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Robust Design and Design Automation for Flexible Hybrid Electronics

Process Design Kit and Design Automation for Flexible Hybrid Electronics

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Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

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Compact Modeling of Thin-Film Transistors for Flexible Hybrid IoT Design

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Flexible Circuits and Systems for Smart Biomedical Applications

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

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Universal Compact Model for Thin-Film Transistors and Circuit Simulation for Low-Cost Flexible Large Area Electronics

Flexible Electronics: the Next Ubiquitous Platform

Flexible Electronics: the Next Ubiquitous Platform This Paper Reviews Thin-Film Materials and Technologies for Flexible Electronics and Considers Future Applications in Healthcare, the Automotive Industry, Human-Machine Interfaces, Mobile Devices, and Other Environments.

Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible Electronics

A New Frontier of Printed Electronics: Flexible Hybrid Electronics

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Robust Design of Large Area Flexible Electronics Via Compressed Sensing

Thin-film Organic Semiconductor Devices: from Flexibility to Ultraflexibility

IGZO-TFT-PDK: Thin-Film Flexible Electronics Design Kit, Standard Cell and Design Methodology

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.