A novel precipitation‐strengthened conductive copper alloy: Cu‐Hf‐Si alloy

Bingbing Shi,Du Hong,Wenweijiao Wang,Longshui Su,Chen Wang,Lei Xiao,Tianyu Ma,Jianhui Zhou

DOI: https://doi.org/10.1002/adem.202300944

IF: 3.6

2023-09-07

Advanced Engineering Materials

Abstract:The Cu‐1.1 wt.% Hf‐0.1 wt.% Si alloy containing various precipitates was studied as a novel precipitation‐strengthened alloy with high strength and high electrical conductivity. The Cu‐Hf‐Si alloy prepared by solution, cold rolling and aging processes, exhibits a hardness of 238.92 HV, a tensile strength of 691.01 MPa, a breaking elongation of 15.09 % and an electrical conductivity of 62.34 % IACS. The optimal peak aging parameter for Cu‐Hf‐Si alloy is 430 °C for 90 min. The precipitation of Hf and Si atoms from the Cu matrix is helpful to enhance the electrical conductivity. The precipitation of Hf can produce fibrous G.P. zone and γ' precipitate, as well as spherical Cu10Hf7 phases. In addition, the co‐precipitation of Si and Hf can also produce Hf3(Cu2Si)2 and HfCuSi phases. The high strength of Cu‐Hf‐Si alloy is mainly due to the multi‐precipitates synergistic strengthening. This article is protected by copyright. All rights reserved.

materials science, multidisciplinary