Ultraviolet Light-Densified Oxide-Organic Self-Assembled Dielectrics: Processing Thin-Film Transistors at Room Temperature

Wei Huang,Xinge Yu,Li Zeng,Binghao Wang,Atsuro Takai,Gabriele Di Carlo,Michael J. Bedzyk,Tobin J. Marks,Antonio Facchetti
DOI: https://doi.org/10.1021/acsami.0c20345
2021-01-08
Abstract:Low-temperature, solution-processable, high-capacitance, and low-leakage gate dielectrics are of great interest for unconventional electronics. Here, we report a near room temperature ultraviolet densification (UVD) methodology for realizing high-performance organic-inorganic zirconia self-assembled nanodielectrics (UVD-ZrSANDs). These UVD-ZrSAND multilayers are grown from solution in ambient, densified by UV radiation, and characterized by X-ray reflectivity, atomic force microscopy, X-ray photoelectron spectroscopy, and capacitance measurements. The resulting UVD-ZrSAND films exhibit large capacitances of &gt;700 nF/cm<sup>2</sup> and low leakage current densities of &lt;10<sup>-7</sup> A/cm<sup>2</sup>, which rival or exceed those synthesized by traditional thermal methods. Both the p-type organic semiconductor pentacene and the n-type metal oxide semiconductor In<sub>2</sub>O<sub>3</sub> were used to investigate UVD-ZrSANDs as the gate dielectric in thin-film transistors, affording mobilities of 0.58 and 26.21 cm<sup>2</sup>/(V s), respectively, at a low gate voltage of 2 V. These results represent a significant advance in fabricating ultra-thin high-performance dielectrics near room temperature and should facilitate their integration into diverse electronic technologies.
materials science, multidisciplinary,nanoscience & nanotechnology
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