Thermal Budget Reduction in Metal Oxide Thin-Film Transistors via Planarization Process

Sunbin Deng,Wei Zhong,Shou-Cheng Dong,Rongsheng Chen,Guijun Li,Meng Zhang,Fion Sze Yan Yeung,Man Wong,Hoi-Sing Kwok
DOI: https://doi.org/10.1109/led.2020.3045018
IF: 4.8157
2021-02-01
IEEE Electron Device Letters
Abstract:This work reports a method to reduce the process thermal budget in metal oxide (MO) thin-film transistors (TFTs). Using the thermal curing of a fluorinated polyimide planarization (PLN) layer as an efficient device activation process, this method eliminates the need for additional annealing steps before the existing PLN process in the fabrication. Bottom-gated TFTs with indium tin oxide (ITO)-stabilized ZnO channels were fabricated by this method and exhibited improved electrical characteristics over control devices made with a higher thermal budget. A steep subthreshold swing of 82.8 mV/decade and a high on-off ratio of ${1.3}times {10}^{{10}}$ were achieved. This improvement can be attributed to the fluorine diffusion from the PLN layer to the MO channels during the curing step. This method is useful for the cost-effective production of active-matrix flat-panel display (AM-FPD) panels and the implementation of MO TFTs on flexible substrates.
engineering, electrical & electronic
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