Low-Temperature Fabrication of Indium Oxynitride Thin-Film Transistors via Plasma-Assisted Solution Process

Xuyang Li,Bin Liu,Xianwen Liu,Guobin Sun,Haifeng Liang,Huan Liu,Qian Mi,Guangcai Yuan,Jianshe Xue,Zhinong Yu
DOI: https://doi.org/10.1109/ted.2023.3276334
IF: 3.1
2023-01-01
IEEE Transactions on Electron Devices
Abstract:The relatively high thermal annealing (TA) temperature and long TA time during the postprocessing seriously impede the application of solution-processed routes in printable flexible metal oxide (MO) electronic devices. Here, we propose a novel low-temperature solution-processed route, which employs NH $_{ ext{3}}$ or N $_{ ext{2}}$ plasma instead of TA to treat preannealing MO thin films, for the fabrication of MO thin films at low temperatures. The results indicate that the NH $_{ ext{3}}$ or N $_{ ext{2}}$ “plasma-assisted solution processes” (PASPs) make the preannealing indium oxide (InO $_{ ext{x}} ext{)}$ thin films change into indium oxynitride (InON) thin films and effectively reduce the postprocessing temperature and time of InON thin films. The InON thin-film transistor (TFT) based on NH $_{ ext{3}}$ PASP exhibits acceptable electrical characteristics with a saturation mobility ( $mu _{ ext{sat}} ext{)}$ of 1.30 cm $^{ ext{2}}$ /Vs and an $ extit{I}_{ ext{on}}$ / $ extit{I}_{ ext{off}}$ of 10 $^{ ext{7}}$ at 160 $^{circ}$ C; however, there are apparent local plasma-damage regions on the surface of InON thin films. Compared to NH $_{ ext{3}}$ PASP, the N $_{ ext{2}}$ PASP shows a better low-temperature activation effect while avoiding plasma damage. The InON TFT based on N $_{ ext{2}}$ PASP exhibits excellent electrical characteristics with $mu _{ ext{sat}}$ of 5.91 cm $^{ ext{2}}$ /Vs and $ extit{I}_{ ext{on}}$ / ${{ extit{I}}}_{ ext{off}}$ of 10 $^{ ext{8}}$ at postprocessing temperatures as low as 100 $^{circ}$ C and time as short as 33 min. These findings highlight the critical role of plasma treatment (PT) atmospheres in the low-temperature fabrication of the InON thin films via PASP and provide an effective low-temperature solution-processed route to guarantee the development of printable flexible MO electronic devices in the future.
engineering, electrical & electronic,physics, applied
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