Impact of Temperature and Process Corners on Read Bit Line of 8T-SRAM Cell for NOR, NAND Operations

Devender pal Singh,Shalini Chaudhary,Basudha Dewan,Menka Yadav
DOI: https://doi.org/10.1080/03772063.2024.2413862
IF: 1.8768
2024-10-19
IETE Journal of Research
Abstract:SRAM reliability is one of the major concerns as it suffers from variations in Static Noise Margin with temperature variations, which degrades the performance. It needs attention due to the increasing impact of process corners, which are variations in parameters due to the switching properties of transistors. Since the SRAM is also used as in-memory computation, stability plays a significant role in the computation. In this manuscript, 8T-SRAM stability for NOR, NAND logic is presented at process corners: Fast NMOS-Fast PMOS (FF), Fast NMOS-Slow PMOS (FS), and Slow NMOS-Slow PMOS (SS), with changes in temperature and monte-carlo simulations are also performed to predict the probability of Read Bit Line (RBL) voltage. The results are obtained using Cadence Virtuoso Simulations at the 45 nm technology node and show that the RBL voltage deviates by 10–30 mV for every 25°C rise in temperature from −25 o C to 125 o C.
telecommunications,engineering, electrical & electronic
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