Preparation of Hydrophobic/Superhydrophobic Surface on Silicon Wafer by Reactive Ion Etching and Self-assembled Monolayers

Z. Hui
Abstract:Micro scale pillar arrays on silicon(100) wafer were generated by reactive ion etching.Three self-assembled monolayers(SAMs) were prepared on etched silicon wafer by self-assembled technique.The results show that four micro pillar arrays generated by reactive ion etching possess regular structures with diameter of 5 μm,height of 10 μm and spacing of 15—45 μm.The water contact angles of silicon wafers increase significantly after SAMs deposition,in which maximum contact angle is abtained for 1H,1H,2H,2H-perfluorodecyltrichlorosilane(FDTS) deposition,medium for 1H,1H,2H,2H-perfluorooctyltrichlorosilane(FOTS) deposition and minimum for octadecyltrichlorosilane(OTS) deposition.The measured contact angles larger than 150° are close to the contact angles calculated with Cassei model.However,the measured contact angles less than 150° approach the contact angles calculated with Wenzel model.Contact angles can be controlled by adjusting spa-cing of pillar array and choosing different SAMs.Atomic force microscope(AFM) measurement show that nano scale clusters on silicon wafers appear after SAMs deposition.Maximum contact angle of 156.0° can be acquired in surface structure with micro pillar array and nano scale SAMs.
Engineering,Materials Science
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