Abstract:This study introduces a novel strategy to enhance the high-temperature electrical performance of the silicone elastomer (SE), while ensuring control over its thermal and mechanical properties for SiC device packaging insulation application. For the same, the ultra-low-content inorganic/organic SE nanocomposites are prepared and tested (at room temperature and 150 degrees C) by grafting polyhedral oligomeric silsesquioxane (POSS) nanofillers and doping organic semiconductors. It is found that grafting POSS nanofillers enhances the SE's thermal and mechanical properties. Moreover, doping the grafted SE with different organic semiconductors (ITIC, PCBM, and NTCDA) further improves its electrical properties and charge dynamics at 150 degrees C. The optimal doping content for ITIC, PCBM, and NTCDA is found to be 0.05, 0.10, and 0.15 wt%, respectively. Among these, NTCDA exhibits superior electrical performance at 150 degrees C. Particularly, compared to pure SE, NTCDA doping and POSS grafting reduce the electrical conductivity by an order of magnitude and increase the breakdown strength, charge hopping activation energy, and trap energy level by 65.5%, 0.20 eV and 0.73 eV, respectively. This study finds that organic semiconductors outperform nanostructures in inhibiting electron injection and immobilizing free electrons at high temperatures.Highlights Nano-POSS grafting enhances material properties by reinforced molecular chains. Charge dynamics is studied by space charge and current integrated charge at HT. Organic semiconductors improve electrical properties and charge dynamics at HT. Organic semiconductors outperform nanofillers in immobilizing electrons at HT. The ideal organic semiconductor doping level correlates with its energy gap. Energy band diagram illustrating potential charge transfer within the composite. image

Generating nonlinear conductive characteristics of micro-silicon carbide/silicone elastomer composites at high temperature utilizing nano-AlN fillers

Enhanced Field-Dependent Conductivity and Material Properties of Nano-Aln/micro-sic/silicone Elastomer Hybrid Composites for Electric Stress Mitigation in High-Voltage Power Modules

Enhanced Thermal and Dielectric Performance of Epoxy Resin/aluminum Nitride Nanocomposites at High Temperatures

Enhanced High-Temperature Electrical Properties and Charge Dynamics of Inorganic/organic Silicone Elastomer Nanocomposites Via Nanostructure Grafting and Molecular Trap Construction

Charge Dynamics and Thermal Properties of Epoxy Based Micro and Nano Hybrid Composites at High Temperatures

Thermal and Electrical Properties of EP/AlN Nanocomposites at Different Temperatures

Optimization of Microstructure to Improve Si3n4 Ceramics with Thermal Conductivity and Mechanical Properties: Effect of Si and Α-Si3n4 Powder Composition

Space charge performance of epoxy composites with improved thermal property at high temperature under high electric field

Enhancement of electrical properties by including nano-aluminum nitride to micro-silicon carbide/silicone elastomer composites for potential power module packaging applications

Preparation of AlN microspheres/UHMWPE composites for insulating thermal conductors

Design of High-temperature Packaging Insulation for Power Modules using Grafted Nanostructured Silicone Elastomer Composites

Tunable nonlinear conductive behavior without percolation threshold and high thermal conductivity of epoxy resin/SiC ceramic foam co-continuous phase composites

Pressureless Sintering and High-Temperature Strength of SiC-AlN Ceramics

Fluoride doped SiC/Si3N4 composite as a high thermal conductive material with enhanced mechanical properties

Nonlinear Conduction and Surface Potential Decay of Epoxy/SiC Nanocomposites

Preparation and Thermal Ablation Behavior of HfB2–SiC‐Based Ultra‐High‐Temperature Ceramics under Severe Heat Conditions

Effect of Silicon Addition and Thermal History on the Thermal Expansion Behavior of Sic/Al Composites

Fabricating superior thermal conductivity SiC–AlN composites from photovoltaic silicon waste

Synergistic effects of oriented AlN skeletons and 1D SiC nanowires for enhancing the thermal conductivity of epoxy composites

Enhancing the Thermal Conductivity of CNT/AlN/Silicone Rubber Composites by Using CNTs Directly Grown on AlN to Achieve a Reduced Filler Filling Ratio

Effect of Micro-Si3n4-Nano-Al2o3 Co-Filled Particles on Thermal Conductivity, Dielectric and Mechanical Properties of Silicone Rubber Composites