Electrical Characteristics of H-Diamond Transistors With ZrO2/Zr Stacked Dielectrics Deposited by Electron Beam Evaporation

Fei Wang,Genqiang Chen,Guoqing Shao,Wei Wang,Minghui Zhang,Yanfeng Wang,Qianwen Zhang,Shi He,Wenbo Hu,Hongxing Wang
DOI: https://doi.org/10.1109/ted.2024.3358257
IF: 3.1
2024-03-06
IEEE Transactions on Electron Devices
Abstract:Enhancement mode diamond field-effect transistors with large threshold voltage and low leakage current are highly in demand for low-power electronics. In this article, hydrogen-terminated diamond (H-diamond) transistors with ZrO2/Zr stacked dielectrics deposited by electron beam (EB) evaporation were demonstrated. The threshold voltages boosted from −0.4 to −2.5 V with gate length increasing from 2 to , indicating the normally- OFF operation. The OFF-state leakage current of 10−8 mA/mm and gate–source leakage current density of about A/cm2 were acquired both for 6- and 8- gate length devices. Additionally, the ON/OFF ratio and subthreshold swing (SS) for the device with a 6- gate length were deduced to be and 128 mV/decade, respectively. The maximum drain current density increases with the gate length shortens and reaches up to −74 mA/mm for the device with a 2- gate length. These performances suggest that the EB method is applicable to fabricate the ZrO2/Zr gate for realizing normally- OFF H-diamond FETs.
engineering, electrical & electronic,physics, applied
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