Abstract:High-pressure die casting (HPDC) components exhibit unique sandwich microstructural features along the thickness direction, thereby displaying solute distribution patterns distinct from those of components produced through alternative casting methods. Considering the notable influence of solute atoms on thermal conductivity, relying solely on the local microstructure to characterize the thermal conductivity of HPDC components is an incomplete approach. This work investigated the effect of thickness-dependent sandwich microstructure on the thermal conductivity of an HPDC model alloy (Mg–4Sm–2Al). The results reveal that the volume fractions of distinct layers ( T Skin / T , T Core / T and T SB / T ) remain constant as plate thickness increases. Nevertheless, the solute atom concentration within the skin layer gradually decreases as plate thickness increases, a phenomenon attributed to the reduced solidification rate, which allows sufficient time for solute atom precipitation. Intriguingly, within the core layer, solute atom concentration follows a nonlinear pattern, decreasing and then increasing. The varied distributions of externally solidified crystals (ESCs) are primarily responsible for this paradoxical increase. As plate thickness increases, the ESCs transform from a clustered core distribution to a uniform through-thickness distribution, progressively altering the solidification behavior of the alloy. Concurrently, an effective model for the sandwich microstructure that considers interactions among solute atoms within the α -Mg matrix is proposed. This model successfully characterizes the thermal conductivity of HPDC alloys and finds application in Mg–Sm–Al system alloys, with a relative error of less than 15 pct between the predicted and experimental results.

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Effect of Thickness-Dependent Sandwich Microstructure on the Thermal Conductivity of HPDC Mg–4Sm–2Al Alloy

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