Comparative investigation of low-power ferroelectric material embedded with different heterojunction vertical TFET structures

Shailendra Singh
DOI: https://doi.org/10.1007/s10854-022-08666-z
2022-07-22
Abstract:This paper basically proposes and compares three different configurations of ferroelectric oxide material on silicon body of vertical tunnel field-effect transistor. The charge plasma-ferro-VTFET (Ferro-CP-VTFET), junctionless ferro-VTFET (Ferro-JL-VTFET), and Ferro-PIN-VTFET device design are compared with different simulation characteristics to validate the outcome with optimized result. The heterojunction Vertical TFET is with gate stack ferroelectric material, with exploring properties in operating the device in ultra-low power applications. All three topologies were enforced at the source–channel interface with a SiGe tunneling heterojunction. The tunneling barrier will be successfully reduced from 1.1 to 0.7 eV thanks to the installation of a SiGe layer. Comparison of the results for all the three combinations has been extracted using TCAD silvaco tools. Various electrical parameters like energy band diagram, surface potential, hole–electron concentration, mobility, and electric field have been fetched for justifying the proposed devices. The simulation result validates the super steep subthreshold slope (14.89 mV/decade) and enhances ON/OFF current ratio with the value of 10.33 × 10 12 , respectively. The highest ON current of PIN-Ferro-VTFET is reported to be 1.31 × 10 –4 A/μm with OFF current at 8.06 × 10 –18 A/μm. Inclusion of the negative capacitance in the series of the gate oxide will decrease the ratio of body capacitance to the oxide capacitance. Finally, in comparison to the conventional TFET, the Ferro-PIN-Vertical TFET has highlighting advantages to ultra-low power application.
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