Comparison of crystalline-silicon/amorphous-silicon interface prepared by plasma enhanced chemical vapor deposition and catalytic chemical vapor deposition

Hideki Matsumura,Koichi Higashimine,Koichi Koyama,Keisuke Ohdaira
DOI: https://doi.org/10.1116/1.4915494
2015-05-01
Abstract:The properties of the interface between crystalline silicon (c-Si) and amorphous silicon (a-Si) were studied for two deposition methods of a-Si. One is the conventional plasma enhanced chemical vapor deposition (PECVD) and the other is catalytic chemical vapor deposition (Cat-CVD), often called hot-wire CVD. Surface recombination velocity (SRV) and atomic scale fine structure at the a-Si/c-Si interface were particularly studied. It is found that the a-Si/c-Si interface is very sharp for Cat-CVD a-Si and the width of transition-layer from c-Si to a-Si is less than 0.6 nm, which is three times smaller than for PECVD a-Si. It is also found that the SRV for Cat-CVD a-Si is about 1/3 of that for PECVD, and that the SRV appears to depend on the effective area of the interface which increases due to increase of surface roughness caused by plasma damage.
engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
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