Interface degradation in Si‐metal‐oxide‐semiconductor structures by homogeneous, microwave heating of channel carriers

Ye Qiu-Yi,A. Zrenner,F. Koch,C. Zeller,G. Dorda,Ye Qiu‐Yi
DOI: https://doi.org/10.1063/1.99417
IF: 4
1988-02-15
Applied Physics Letters
Abstract:Using a pulsed microwave source to provide a strong lateral electric field in a Si-metal-oxide-semiconductor structure, we observe interface degradation by hot holes. Damage occurs in a two-step process. Holes are trapped in the oxide at low temperature and are subsequently converted into interface states in an annealing step at room temperature.
physics, applied
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