The interfaces of lanthanum oxide-based subnanometer EOT gate dielectrics.

Hei Wong,Jian Zhou,Jieqiong Zhang,Hao Jin,Kuniyuki Kakushima,Hiroshi Iwai
DOI: https://doi.org/10.1186/1556-276X-9-472
2014-01-01
Nanoscale Research Letters
Abstract:When pushing the gate dielectric thickness of metal-oxide-semiconductor (MOS) devices down to the subnanometer scale, the most challenging issue is the interface. The interfacial transition layers between the high-k dielectric/Si and between the high-k dielectric/gate metal become the critical constraints for the smallest achievable film thickness. This work presents a detailed study on the interface bonding structures of the tungsten/lanthanum oxide/silicon (W/La2O3/Si) MOS structure. We found that both W/La2O3 and La2O3/Si are thermally unstable. Thermal annealing can lead to W oxidation and the forming of a complex oxide layer at the W/La2O3 interface. For the La2O3/Si interface, thermal annealing leads to a thick low-k silicate layer. These interface layers do not only cause significant device performance degradation, but also impose a limit on the thinnest equivalent oxide thickness (EOT) to be achievable which may be well above the requirements of our future technology nodes.
What problem does this paper attempt to address?