Analysis of trench termination in 4H-nSiC based power devices
Jyoti Verma,Sangeeta Pant,Anuj Kumar,Bhupendra Kumar Jangir,Jasvir Dalal,Mangey Ram
DOI: https://doi.org/10.1016/j.matpr.2021.02.226
2021-01-01
Materials Today: Proceedings
Abstract:Power generation and its distribution are highly required to support the health-care, comfort, and transportation of next generation. Silicon-based power devices have reached their theoretical limit. Alternative solution is suggested by introduction of wide bandgap semiconductors, i.e., SiC, GaN, etc. Maturity in crystal quality and availability in the market makes SiC a promising candidate to adopt in fabrication of power devices. However, their full potential is inhibited by lack of efficient trench termination technique. This work reports trench terminated 4H-nSiC based Schottky barrier diode structure using Al2O3 as a dielctric material. ATLAS device simulator of Silvaco software is used to simulate the device structures. Various models like SRH and Auger recombination, Fermi Dirac, parallel and concentration field dependent mobility, incomplete ionization, Selberherr impact ionization, etc. have been included. Due to high potential and electric field crowding at edges of unterminated schottky barrier diodes, their is predicted as ~ 350 V. However, the potential and therefore the electric field at edges of SBD has been minimized by forming a trench at its edges. The trench in the designed structure is filled with SiO2, Polyimide and with Al2O3. The high permittivty of dielctric material filled in the trench leads to enhancement in breakdown voltage of the device to ~ 1875 V.