Abstract:Grinding executed in a lapping configuration is an alternative finishing process benefiting from both grinding and free-abrasive machining, while minimizing the heat effect impact. Electroplated tools can be effectively used in different abrasive processes, including high-speed grinding, however, the assessment of machining performance over time is a key factor in their correct use to achieve satisfactory technological results. In conventional grinding, bigger grain-coverage provides better results due to the higher bonding strength of grains. In lap-grinding, fracturing and crushing of the abrasive particles initially covered by the plating result in a suspension which is typically dosed continuously in free-abrasive machining. Due to this, the process transforms from two-body (grinding) to three-body abrasion (free abrasive machining) which may result in reduced grinding performance approaching asymptotically a specific value while improving surface finish. The main aim of the presented study is the evaluation of electroplated CBN tools used in lap-grinding of 40H alloy steel workpieces whose hardness was 54 HRC. The obtained results and observations of the working surface of CBN wheels and workpieces allowed for the identification of the wear characteristics for three nickel plating thicknesses corresponding to 35%, 50% and 65% of the nominal CBN crystal size and for specific process parameters. The surface roughness Ra parameter decreased gradually from the initial value 1.9 μm to the values below 0.7 μm for bigger B107 grains and for all plating thicknesses. For smaller B64 grains, the surface roughness and waviness parameters reached similar values to those obtained for the larger B107 grains at corresponding processing times. The lowest value of Ra parameter below 0.4 μm was obtained for B64 grains and for the thinnest plating but with a 50% reduction in material removal comparing to B107 grains. The Preston equation was employed to calculate the material removal as a function of time under variable process conditions in the machining zone due to the tool wear. This attempt extended the range of the material removal modeling, despite the fact that the electroplated wheels were subject to wearing down resulting in the gradual reduction in the efficiency, as well as in the change of the working conditions in the workpiece-tool contact zone.

Modified Preston Equation- Revisited

Modification of the Preston equation for the chemical–mechanical polishing of copper

An Analytical Aspect of the Preston Equation

Polisher density into Preston equation

Study on the Removal Function of Annular Polishing Pad Based on the Computer Controlled Polishing Technology

An experimental and numerical analysis on the validity of Preston coefficients in mechanistic prediction methods used for abrasive flow machining (AFM)

Development of the improved Preston equation for abrasive flow machining of aerofoil structures and components

Modeling and Experimental Analysis of the Material Removal Rate in the Chemical Mechanical Planarization of Dielectric Films and Bare Silicon Wafers

A Model for Mechanical Wear and Abrasive Particle Adhesion during the Chemical Mechanical Polishing Process

The use of Preston equation to determine material removal during lap-grinding with electroplated CBN tools

An Empirical Approach to Explain the Material Removal Rate for Copper Chemical Mechanical Polishing

A Coupled Material Removal Model for Chemical Mechanical Polishing Processes

Development of a Collisional Dissipation Rate Model for Frictional Cylinders

Effects of corrosion environments on the surface finishing of copper chemical mechanical polishing

Experimental Investigation and Modeling of Friction Coefficient and Material Removal During Optical Glass Polishing

The Validity of the Reynolds Equation in Modeling Hydrostatic Effects in Gas Lubricated Textured Parallel Surfaces

Non-continuum Material Removal Mechanism of Surface Polishing with Ultra Precision

Estimating Chemical Mechanical Polishing Pad Wear with Compressibility

Material Removal Mechanism in Chemical Mechanical Polishing: Theory and Modeling

A quantitative study of removal mechanism of copper polishing based on a single pad-asperity polishing test