The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching

Jonghyeok Kim,Byungjoo Kim,Jiyeon Choi,Sanghoon Ahn
DOI: https://doi.org/10.3390/mi15030320
IF: 3.4
2024-02-26
Micromachines
Abstract:This research focuses on the manufacturing of a glass interposer that has gone through glass via (TGV) connection holes. Glass has unique properties that make it suitable for 3D integrated circuit (IC) interposers, which include low permittivity, high transparency, and adjustable thermal expansion coefficient. To date, various studies have suggested numerous techniques to generate holes in glass. In this study, we adopt the selective laser etching (SLE) technique. SLE consists of two processes: local modification via an ultrashort pulsed laser and chemical etching. In our previous study, we found that the process speed can be enhanced by changing the local modification method. For further enhancement in the process speed, in this study, we focus on the chemical etching process. In particular, we try to find a proper etchant for TGV formation. Here, four different etchants (HF, KOH, NaOH, and NH4F) are compared in order to improve the etching speed. For a quantitative comparison, we adopt the concept of selectivity. The results show that NH4F has the highest selectivity; therefore, we can tentatively claim that it is a promising candidate etchant for generating TGV. In addition, we also observe a taper angle variation according to the etchant used. The results show that the taper angle of the hole is dependent on the concentration of the etchant as well as the etchant itself. These results may be applicable to various industrial fields that aim to adjust the taper angle of holes.
chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
What problem does this paper attempt to address?
The problem that this paper attempts to solve is to improve the production efficiency of generating Through - Glass Vias (TGV) in glass by Selective Laser Etching (SLE) technology. Specifically, the researchers hope to accelerate the etching speed by optimizing the etchant in the chemical etching process and adjust the taper angle of the holes. Four different etchants (HF solution, NaOH solution, KOH solution and NH_4F solution) were compared in the study to determine which etchant can provide the highest selectivity and the best etching effect, thereby improving the production efficiency of TGV. The main objectives of the study include: 1. **Increase the etching speed**: By testing the selectivity of different etchants (i.e., the ratio of the etching rate of the modified area to that of the non - modified area), look for the optimal etchant that can accelerate the etching process. 2. **Adjust the taper angle of the holes**: Study the influence of different etchants and their concentrations on the taper angle of the holes to meet the needs of different industrial applications. The research results show that the NH_4F solution has the highest selectivity among all the tested etchants, can complete the formation of TGV within 3 hours, and the formed hole taper angle is 60°, indicating that the NH_4F solution is an efficient etchant suitable for TGV manufacturing. In addition, the study also found that different etchants and their concentrations have a significant impact on the taper angle of the holes, which provides a new method for adjusting the geometry of the holes.