Abstract:In recent years, the femtosecond laser becomes a promising tool to fabricate 3D microstructures for their applications in micro-optics, microfluidics and biofabrication. Various femtosecond-laser-based processes have been used for machining high-precise microstructures with arbitrary shapes. However, the efficiency problem of the femtosecond laser micro-fabrication has hindered its practical applications. Here we present a simple, high-efficient maskless technique to fabricate 3D microstructures on glasses using a femtosecond laser wet etch (FLWE) process. In the FLWE process, the ultrafast laser delivers intensity and time-controlled, programmable arranged, individual pulses to a glass chip. The sample is then subjected to wet-etch processing. The laser pulses change the physical and chemical properties of the glass in the focal spots, and the wet-etch processing that follows carves out a unique 3D microstructures array pattern. Using this method, we fabricated microlens with the diameter: 80 ��m, height: 6.7 ��m and surface roughness: less than 10 nm. We fabricated microstructures on glass surface like microlens arrays with different characteristics like high-fill ratio, high-aspect ratio, controllable shape and arrange, and so on. We also fabricated microstructures like spiral microchannels inside glasses using the FLWE process. The diameter of the spiral microchannel is 20 ��m, and the length-diameter ratio is more than 100. These 3D microchannels will be served as the alternatives of the 2D microstructures in the conventional microfluidic devices.

Scanning strategy-dependent etching rate in the formation of through-via holes by femtosecond laser-assisted etching

Etch the Borosilicate Glass to Form a Straight Through-Glass-via Based on the FLACE Technology

Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching

Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging

Ultra‐high Aspect Ratio TGV Perforation Utilizing Selective Laser‐induced Etching with Nanochannels

Three-Dimensional Microdrilling of Glass by Multiphoton Process and Chemical Etching

Micro-nano fabrication of femtosecond laser wet etch

A New Method of TGVs for Fast Filling of Metal Paste

Fabrication of through sapphire vias by femtosecond laser bidirectional drilling

Ultrafast and precision drilling of glass by selective absorption of fiber-laser pulse into femtosecond-laser-induced filament

High-quality Rapid Laser Drilling of Transparent Hard Materials

Laser Etching Holes Diameter Controlling and Transverse Etching

Processing Microstructure on Film by Femtosecond Laser

Silicon microstructure processing method based on femtosecond laser treatment and wet etching

Hole Drilling of Silica Glass with Infrared Femtosecond Laser Pulses

Investigation on Femtosecond Laser-Assisted Microfabrication in Silica Glasses

Research on Wafer-Level MEMS Packaging with Through-Glass Vias

Fabrication of Microchannels on Silica Glass by Femtosecond Laser Multi-Scan： from Surface Generation Mechanism to Morphology Control

Simultaneous Multi-Microhole Drilling of Soda-Lime Glass by Water-Assisted Ablation with Femtosecond Laser Pulses

Bessel Beam Femtosecond Laser Interaction with Fused Silica Before and After Chemical Etching: Comparison of Single Pulse, MHz-Burst, and GHz-Burst