Enhanced Strength and Ductility of Boron Nitride Nanosheet Reinforced Cu Composites Through Constructing an Interfacial Three-Dimensional Structure

Yekun Yuan,Jianhong Yi,Liang Liu,Rui Bao,Caiju Li,Yichun Liu,Fengxian Li,Xin Kong,Xiaofeng Chen

DOI: https://doi.org/10.1016/j.matchar.2024.114474

IF: 4.537

2024-01-01

Materials Characterization

Abstract:To address the poor wettability and weak interface bonding between boron nitride nanosheet (BNNS) and Cu, BNNS/CuTi composites were prepared through matrix microalloying by adding 1 wt% Ti. Solid-state interfacial reactions resulted in the formation of TiN transition layers and TiB whiskers (TiBw), collectively constructed a BNNS-(TiN&TiB)-Cu interfacial three-dimensional structure (I-3DS). The coherent I-3DS significantly reduced the interfacial energy, improved the interfacial stability, and achieved a favorable combination of strength and ductility in BNNS/CuTi composites. The 0.1 wt% BNNS/CuTi composite achieved an ultimate tensile strength (UTS) of 485 MPa, representing increases of 114 % and 62 % over pure Cu and 0.1 wt% BNNS/Cu composite, respectively. The interlocking structure formed by I-3DS and Cu doubled the theoretical interface shear strength limit and improved load transfer efficiency. This study offered new insights into the innovative design of highperformance Cu matrix composites (CMCs) by constructing I-3DS.