Abstract:As the enhanced acceleration performance of electric vehicles demands improved mileage capabilities, 3D packaging is a promising solution for developing high-power-density SiC power modules. However, 3D pack-aging causes instability owing to the increased heat flux and heat dissipation inside the power module. Thus, this paper proposes an ultra-thermostable embedded liquid cooling strategy for the thermal management of SiC 3D packaging power modules in electric vehicles. We constructed an embedded micro pin-fin (E-MPF) with non-uniform density in the SiC substrate to mount the SiC Schottky barrier diodes (SBDs). The thermostability and temperature uniformity of the SiC 3D packaging power modules containing E-MPF SiC and direct bond copper (DBC) substrates were verified. The results revealed that the SiC SBDs mounted on the E-MPF SiC substrate could stably operate up to a total power dissipation of 320 W at a 100 mL/min coolant (water) flow rate, whereas those attached on the DBC substrate could be operated only under 144 W (operation terminated at a maximum junction temperature of 175 celcius). Furthermore, the junction-to-coolant thermal resistance of the E-MPF SiC substrate could be reduced by 78.89 % compared to that of the DBC substrate. Moreover, the prepared 3D stacking package effectively improved the temperature uniformity of the SiC power modules by 68.69 %. The presented ultra-thermostable E-MPF substrate SiC power module can steadily render a motor torque elevation that is one magnitude greater than that required for sustaining the boiling-free condition on the DBC substrate. This embedded liquid-cooling architecture affords a feasible solution for the thermal management of upcoming high-power electric vehicle SiC inverters.

A Low-Thermal-Stress Double-Sided Cooling Wire-Bondless Package Structure of SiC Power Modules for High-Temperature Applications

Analysis of Novel Packaging Techniques for High Power Electronics in SiC

High power SiC inverter module packaging solutions for junction temperature over 220°C

A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic Applications

Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature

Design and Research on Package Insulation of Highvoltage Silicon Carbide Module

A High Performance Power Module with >10kV capability to Characterize and Test In Situ SiC Devices at >200°C Ambient

High temperature wireless packaging of SiC power device by organic-free die-attach material sintering

Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux

High Temperature Direct Double Side Cooled Inverter Module for Hybrid Electric Vehicle Application

Thermomechanical Stress Analysis, Characterization and Optimization for Double-Side Cooled Power Modules with Ceramic Substrate

High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module

Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package

High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial

Ultra-thermostable Embedded Liquid Cooling in SiC 3D Packaging Power Modules of Electric Vehicles

Compact Sandwiched Press-Pack SiC Power Module With Low Stray Inductance and Balanced Thermal Stress

Development of a 1200 V, 120 A SiC MOSFET module for high-temperature and high-frequency applications

Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement

A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications

Design of High-temperature Packaging Insulation for Power Modules using Grafted Nanostructured Silicone Elastomer Composites

Design of a Novel Double Sided Cooling SiC Power Module Based on Multiple DBC-Stacked