High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial

Hui Ren,Guisheng Zou,Zhenyu Zhao,Mengya Wan,Hongqiang Zhang,Qiang Jia,Lei Liu

DOI: https://doi.org/10.1109/tcpmt.2020.3038430

2020-01-01

IEEE Transactions on Components Packaging and Manufacturing Technology

Abstract:This article presents a wireless packaging design for SiC power device, which displays low induction, good thermal management performance, and excellent high-temperature reliability. A novel organic-free nanomaterial fabricated by ultrafast pulsed laser deposition (PLD) is employed as the bonding material for both die attach and die top. With t(on) = 20 s and Delta T-J = 200 K, longtime power cycling tests were performed to evaluate the high-temperature reliability of the packaging, and 11 500 cycles were achieved before failure. The Cu ribbon bonded by the nanomaterial eliminated hot spot on the die top and facilitated heat dissipation, which improved thermal management performance of this packaging. Failure analysis and simulation indicate that thermal stress in the interconnection layer is considered as the primary failure mode under high-temperature operation.