Influence of Applied Tensile/Compressive Stress on He-Irradiated SiC: Examining Defect Evolution Through Experimental Investigation and DFT Simulations

Chun Liu,Nabil Daghbouj,Chao Zhang,Zhongzheng Wu,Wei Cheng,Tomas Polcar,Bingsheng Li
DOI: https://doi.org/10.1016/j.ceramint.2024.09.136
IF: 5.532
2024-01-01
Ceramics International
Abstract:This study investigates the effects of applied tensile and compressive stresses on the evolution of defects in He- irradiated silicon carbide (SiC) materials. By combining experimental studies with density-functional theory (DFT) simulations, we systematically analyzed the microstructural changes and defect formation mechanisms in SiC under stress. The research focused on He irradiation of SiC at 750 degrees C, with a fluence of 1 x 1017 1 7 He/cm2. 2 . The results revealed that the strain resulting from radiation damage depends on the applied stress during irradiation. Moreover, the formation of platelets is influenced by this applied stress: tensile stress promotes platelet growth, while compressive stress inhibits it. DFT simulations further supported these experimental findings by showing that under tensile strain, both carbon vacancies (Cv) and He atoms exhibit low energy barriers for migration. This phenomenon facilitates platelet growth, aligning well with the observations made in the experiments. However, when considering applications like semiconductor thin film transfer, such as the Smart-cut technique, He implantation under tensile stress can actually be advantageous. This approach enables the use of lower He fluence, which in turn reduces the overall cost of the operation. By strategically leveraging the effects of tensile stress on He implantation, it becomes possible to optimize processes like Smart-cut for more efficient and cost-effective thin film transfer in semiconductor manufacturing.
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