Finite Element Analysis of the Effect of Semi-Die Angle During Drawing on the Properties of Bi-2223 Superconducting Wires

Xueqian Liu,Zesheng Zhou,Shengnan Zhang,Jixing Liu,Qingbin Hao,Xiaobo Ma,Jianfeng Li,Chengshan Li,Pingxiang Zhang
DOI: https://doi.org/10.1109/tasc.2024.3367793
IF: 1.9489
2024-01-01
IEEE Transactions on Applied Superconductivity
Abstract:Finite element Modelling (FEM) using ABAQUS was employed to study the effect of semi-die angle during drawing process on associated properties of Bi-2223 wires. FEM models for deformation of monofilamentary and multifilamentary wire were developed. The powder density, stress distribution during deformation, equivalent plastic strain after deformation was calculated by FEM and used to analyze experimental results on the densification state, drawing force, wire structure and hardness distribution in Bi-2223 wires. It is suggested that smaller semi-die angle of 6(degrees) results in larger axial tensile load during drawing but provides better radial homogeneity, a larger semi-die angle of 14(degrees) provides higher radial pressure but increases the risk of internal breakage of the Ag matrix due to stress concentration.
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