Numerical Simulation of Drawing Process for Bi Superconducting Single-filament Tape

Cai Fang,Lei Liping,Zhao Yinghong,Zeng Pan
DOI: https://doi.org/10.3321/j.issn:1004-132X.2006.19.008
2006-01-01
Abstract:The drawing process of a high temperature superconducting single-filament tape was studied. With axisymmetrical model of the drawing processing of the superconductor filament established, the influences of the processing parameters such as the angle of the drawing die, cross-sectional reduction ratio and friction coefficient on the drawing process were analyzed. According to the multi-objective optimization problem related with radial volumetric strain, drawing force, friction dissipation energy and residual stresses, linear weighted method was implemented to determine the optimized drawing angle.
What problem does this paper attempt to address?