Growth of Single-Crystalline GeSn Films with High-Sn Content on InP Substrates by Sputtering and Rapid Thermal Annealing

Chuhui Tan,Shaoying Ke,Junhong Lv,Yuan Huang,Dongsheng Peng,Zhuochen Duan,Yujuan Wu,Jie Yang,Feng Lin,Chong Wang
DOI: https://doi.org/10.1016/j.apsusc.2024.159707
IF: 6.7
2024-01-01
Applied Surface Science
Abstract:In this work, the polycrystalline GeSn film with Sn content of 25.3 % on InP is obtained by sputtering at room temperature and then rapid thermal annealing (RTA) at 300 celcius. The single-crystalline GeSn film with Sn content of 24.7 % on InP is obtained by sputtering at 200 celcius and then RTA at 300 celcius. This indicates that the growth temperature is one of the key factors affecting the formation of single-crystalline films. The effects of the sputtering power and film thickness on the crystallization of the GeSn films are investigated. The competition between the spontaneous and substrate-induced crystallization of the films limits the preparation of singlecrystalline GeSn films. The strain relaxation of the film (R = 69.3 %) is achieved by annealing. The device fabricated by the GeSn film exhibits a high response of 18.1 A/W @-1 V at room temperature with the 1550-nmline excitation. These suggest that sputtering epitaxy can be an effective method for growing single-crystalline GeSn films with high-Sn content on InP substrates, which is of great significance for developing highperformance mid-infrared devices.
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