Densification behavior, mechanical and electrical properties of in-situ TiB 2p /Cu composite powder via vacuum hot pressing
Hao Shi,Fei Cao,Haidong Zhang,Tongle Wang,Huaibao Gao,Binbin Wen,Juntao Zou,Yihui Jiang,Shuhua Liang
DOI: https://doi.org/10.1016/j.matchar.2023.113004
IF: 4.537
2023-05-20
Materials Characterization
Abstract:The spherical TiB 2p /Cu composite powder was prepared first by in-situ reaction coupled with the gas atomization method, then the bulk TiB 2p /Cu composites with diffusely distributed sub-micron TiB 2p were prepared by vacuum hot pressing (VHP). The densification behavior of in-situ TiB 2p /Cu composite powder compacts during sintering was investigated, indicating that the existence of TiB 2p inhibits the densification. The ultimate tensile strength, conductivity and relative density of the sintered TiB 2p /Cu composite are 400 MPa, 89.7% IACS and 99.7%, respectively, and the reasons for the high strength and conductivity of the composites were discussed. This work is expected to provide a technically viable solution for the preparation of high-performance TiB 2p /Cu composite by VHP with in-situ composite powder.
materials science, multidisciplinary,metallurgy & metallurgical engineering, characterization & testing