The Dominant Factors Affecting the Memory Characteristics of (ta2o5)x(al2o3)1−x High-K Charge-Trapping Devices

Chang-De Gong,Qin Yin,Xiaoxia Ou,Xuexin Lan,Jinqiu Liu,Chong Sun,Laiguo Wang,Wei Lu,Jinhua Yin,Bin Xu,Yidong Xia,Zhiguo Liu,Aidong Li
DOI: https://doi.org/10.1063/1.4896595
IF: 4
2014-01-01
Applied Physics Letters
Abstract:The prototypical charge-trapping memory devices with the structure p-Si/Al2O3/(Ta2O5)x(Al2O3)1−x/Al2O3/Pt(x = 0.5, 0.3, and 0.1) were fabricated by using atomic layer deposition and RF magnetron sputtering techniques. A memory window of 7.39 V with a charge storage density of 1.97 × 1013 cm−2 at a gate voltage of ±11 V was obtained for the memory device with the composite charge trapping layer (Ta2O5)0.5(Al2O3)0.5. All memory devices show fast program/erase speed and excellent endurance and retention properties, although some differences in their memory performance exist, which was ascribed to the relative individual band alignments of the composite (Ta2O5)x(Al2O3)1−x with Si.
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