MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER

Y.Zhou,C.S.Yang,J.A. Chen,G.F. Ding,L. Wang,M.J Wang,Y.M Zhang,T.H Zhang
2004-01-01
Acta Metallurgica Sinica (English Letters)
Abstract:Microbridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. In order to measure the mechanicalproperties of nickel film microbridges, special sh...
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