Low Dielectric Post-Cured Benzocyclobutene-Functionalized Fluorine-Containing Polyimide Material

Jianhao He,Xueliang Wu,Yuanrong Cheng
DOI: https://doi.org/10.1016/j.eurpolymj.2023.112334
IF: 6
2023-01-01
European Polymer Journal
Abstract:Low dielectric constant (Dk) polyimide polymer materials are one of most attractive materials for their importance in microelectronic industries, such as high speed communication field. Herein, a novel benzocyclobutene (BCB) and trifluoromethyl functionalized diamine monomer (BFDA) was synthesized and used to prepare a series of co-polyimides with different BCB content (PI-BFs). Both trifluoromethyl and BCB structure can facilitate to low down Dk and dissipation factor (Df). For the cured PI-BFs, dielectric property test showed that the dielectric constant decreased significantly with the increase of BCB content, and the dielectric constant of PI-BF40% could reach 2.72 at 1 MHz. Besides, BCB can also contribute to improve glass transition temperature and initial storage modulus of PI-BFs. The Tg of PI-BF40% was 360 degrees C, and the initial storage modulus reached 2.83 GPa. Meanwhile, TMA test indicates that the post-curing by BCB group contributes to enhance the thermo-size stability. Moreover, PI-BFs show excellent thermal stability (Td5 > 499 degrees C), good transparency and low water uptake.
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