Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

Yuying Sui,Jinhui Li,Tao Wang,Deliang Sun,Chao Huang,Fan Zhang,Liang Shan,Fangfang Niu,Guoping Zhang,Rong Sun
DOI: https://doi.org/10.1016/j.polymer.2021.123514
IF: 4.6
2021-03-01
Polymer
Abstract:<p>Polyimides (PIs) with remarkable mechanical, thermal, dielectric properties have been extensively employed in electronic package of integrated circuit industry. However, PI is imidized at high temperature (&gt;350 <sup>o</sup>C) traditionally, which limits its application in thin-film transistor and fan-out wafer level package (FOWLP). In this work, active curing catalyst of 5-aminobenzimidazole is introduced in covalent bond to get a low temperature curable polyimide with superior comprehensive properties. The results prove that PI-3 can be imidized completely at 200 <sup>o</sup>C in 2 hours and the imidization index could be as high as 1.03. Besides, the PI films exhibit excellent thermal stability of which the temperature for 5% weight loss is as high as 526 <sup>o</sup>C and glass transition temperature is 428 <sup>o</sup>C which is obtained by dynamic mechanical analyzer. Moreover, the tensile test shows the tensile strength of PI-3 is 91 MPa and elongation at break is about 15%. All these results prove the superior performance of the low temperature curing PIs, showing great potentials in the advanced package in the FOWLP and the others.</p>
polymer science
What problem does this paper attempt to address?
The problem that this paper attempts to solve is that in the field of electronic packaging, traditional polyimide (PI) materials need to be imidized at high temperatures (>350°C), which limits their use in applications such as thin - film transistors (TFT) and fan - out wafer - level packaging (FOWLP). To overcome this limitation, the researchers introduced a 5 - aminobenzimidazole (5 - aminobenzimidazole, A - BZI) connected by covalent bonds as an active curing catalyst to achieve a polyimide material with low - temperature curing while maintaining excellent comprehensive properties, such as mechanical strength, thermal stability, and dielectric properties. Specifically, the goal of the paper is to develop a polyimide material that can complete the imidization reaction at a relatively low temperature (for example, 200°C), thereby reducing problems caused by high - temperature treatment, such as color change of the color filter, warpage caused by the mismatch of the coefficient of thermal expansion (CTE) between the packaging material and the epoxy molding compound (EMC). Through this method, the researchers hope to improve the applicability of polyimide materials in advanced packaging technologies, especially in FOWLP and other related fields.