Abstract:Polyimide (PI) films have excellent comprehensive properties and bright prospects in the next generation of optoelectronic and microelectronic applications. PIs were synthesized by aromatic diamines and alicyclic dianhydrides considered to be the most effective method for preparing polyimides with high light transmittance and low dielectric constant. In order to improve the overall performance of polyimide, the introduction of a large trifluoromethyl group into the main chain is also considered a powerful strategy. In this article a novel diamine containing 6 trifluoromethyl groups has been designed and synthesized by Suzuki reaction. Afterwards, PIs were synthesized with fluorinated aromatic dianhydride and alicyclic dianhydride through a two-step method. The two PIs have excellent solubility: PI-a and PI-b exhibited excellent solubility in common polar solvents. Such as DMF, DMAc, NMP and DMSO at room temperature, and PI-a was soluble in low-boiling solvents such as ethyl acetate, CH2Cl2 and CHCl3 at room temperature. PI-b was soluble in low-boiling solvents acetone and CHCl3 at room temperature, which was rarely seen in other aromatic polyimides. Soluble in common organic solvents, especially low boiling point solvents, made these polymers easy to process and suitable for processing technology in solution. This was an important modification for PIs. They also showed good high temperature resistance: the decomposition temperature (T5%) of two PIs were 520 °C and 475 °C. In addition, the residual rate at 790 °C was 50 % and 49 % respectively. Two PI films had a very low dielectric constant 2.26 and 2.24, respectively, which was attributed to the hyperbranched structure and strong electron-withdrawing fluorine-containing groups. PI-a and PI-b also had low water absorption of 0.66 % and 0.72 %, respectively. The transmittance of PI-a and PI-b high transparent films at 450 nm were 74% and 82%, respectively. The significant optical modification was mainly due to the weak electron-accepting alicyclic unit and the large trifluoromethyl electron withdrawing group. This work mainly provided an effective strategy for synthesizing comprehensive excellent performance PIs with high transmittance, excellent solubility, low water absorption, high heat resistance and low dielectric constant.

Polyimides with Low Dielectric Constant and Dissipation Factor at High Frequency Derived from Novel Aromatic Diamine with Bistrifluoromethyl Pendant Groups

Polyimide Foams with Ultralow Dielectric Constants

Preparation of fluorinated polyimides with low dielectric constants and low dielectric losses by combining ester groups and triphenyl pyridine structures

Synthesis and Characterization of High Fluorine‐containing Polyimides with Low‐dielectric Constant

Reducing the Permittivity of Polyimides for Better Use in Communication Devices

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Fluorinated polyimide with triphenyl pyridine structure for 5G communications: Low dielectric, highly hydrophobic, and highly transparent

Frequency-dependent dielectric properties of aromatic polyimides in the 25–330 GHz range

APDS modified several bisphenol A polyimides with low dielectric constant under high frequency

Preparation and characterization of organic soluble polyimides with low dielectric constant containing trifluoromethyl for optoelectronic application

Preparation of Triphenylamine Polyimides with Low Dielectric Constants with Different Side Group Sizes Based on Β-Relaxation Theory

Preparation and Characterization of Electrospun Fluoro-Containing Poly(imide-benzoxazole) Nano-Fibrous Membranes with Low Dielectric Constants and High Thermal Stability

Thermoplastic Polyimide with Low Dielectric Properties Enabled by the 2,2′-Spirobifluorene Group

Synthesis and applications of low dielectric polyimide

Organosoluble polyimides with low dielectric constant prepared from an asymmetric diamine containing bulky m-trifluoromethyl phenyl group

A Facile Strategy for Intrinsic Low-Dk and Low-Df Polyimides Enabled by Spirobifluorene Groups

Construction of fluorenyl‐modified low dielectric constant polyimide films with excellent mechanical properties and optical transparency

Poly(ester imide)s with Low Linear Coefficients of Thermal Expansion and Low Water Uptake (VII): A Strategy to Achieve Ultra-Low Dissipation Factors at 10 GHz

Low Dielectric Post-Cured Benzocyclobutene-Functionalized Fluorine-Containing Polyimide Material

Enhanced performance of low-dielectric siloxane-polyimide copolymers: Synthesis and properties

Polyimide Films with Liquid‐Crystal‐Like Structures: Toward Ultralow Dielectric Loss at High Frequencies