Abstract:Fan-out Wafer-level Packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission loss at high frequencies. Polyimides (PIs) are widely used as interlayer dielectric materials in FOWLP for their excellent comprehensive properties. However, addressing the challenge of decreasing the dielectric constant and dissipation factor of PIs at high frequencies to meet the application requirements remains an active pursuit in both industry and academia. In this study, we designed and synthesized a novel diamine monomer featuring bis(trifluoromethyl) pendant groups, denoted as 4,4'-((3',5'-bis (trifluoromethyl)-[1,1'-biphenyl]-3,5-diyl)bis(oxy))dianiline (HFBODA). The binary polymerization of this diamine monomer with common dianhydrides led to promising outcomes. Remarkably, 6FDA-HFBODA exhibited excellent properties among the prepared PIs (Td,5% =521°C, Tg = 240°C, Dk = 2.63 and Df = 3.72×10-3 @ 10 GHz. Additionally, BPADA-HFBODA demonstrated an ultra-low Df value of 2.30×10-3 @ 10 GHz. The relationship between the charge density of imide in PIs and the dissipation factor of PIs was investigated for the first time. By introducing strong electron-withdrawing groups to the side group of PI, the effect of imide ring on orientation polarization was greatly declined, thus the dissipation factor of PI at high frequency was significantly decreased. Besides, the relationship between the structures and other essential properties of PIs in this study was systematically explored. This work provided a novel diamine and demonstrated the role of trifluoromethyl located in side group in lowering dissipation factors of PIs at high frequencies. The introduction of bis(trifluoromethyl) pendant group led to a reduction in polarizability and an increase in free volume within the PIs. Moreover, the electron-withdrawing effect of trifluoromethyl group substantially minimized the probability of internal friction among dipoles, resulting in reduced dielectric constants and dissipation factors. These findings provided crucial insights and guidance for the future design and research of low dielectric constant and dissipation factor PIs, particularly for high-frequency applications in Fan-out Wafer-level Packaging.

Thermoplastic Polyimide with Low Dielectric Properties Enabled by the 2,2′-Spirobifluorene Group

Polyimide Foams with Ultralow Dielectric Constants

Thermoplastic polyimide with good comprehensive performance based on carbazole groups and short flexible linkages

A Facile Strategy for Intrinsic Low-Dk and Low-Df Polyimides Enabled by Spirobifluorene Groups

Preparation and Dielectric Properties of Polyimide Foams Containing Crosslinked Structures

Preparation of fluorinated polyimides with low dielectric constants and low dielectric losses by combining ester groups and triphenyl pyridine structures

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Polyimides with Low Dielectric Constant and Dissipation Factor at High Frequency Derived from Novel Aromatic Diamine with Bistrifluoromethyl Pendant Groups

Temperature-Resistant Intrinsic High Dielectric Constant Polyimides: More Flexibility of the Dipoles, Larger Permittivity of the Materials

Reducing the Permittivity of Polyimides for Better Use in Communication Devices

Preparation and Characterization of Electrospun Fluoro-Containing Poly(imide-benzoxazole) Nano-Fibrous Membranes with Low Dielectric Constants and High Thermal Stability

Preparation of Triphenylamine Polyimides with Low Dielectric Constants with Different Side Group Sizes Based on Β-Relaxation Theory

Synthesis and properties of modified thermoplastic polyimide films with good dielectric properties at high frequency and enhanced thermal stability via incorporation of rigid ester and biphenyl structural units

Synthesis and Characterization of High Fluorine‐containing Polyimides with Low‐dielectric Constant

Fluorinated polyimide with triphenyl pyridine structure for 5G communications: Low dielectric, highly hydrophobic, and highly transparent

Polyimide resins with superior thermal stability, dielectric properties, and solubility obtained by introducing trifluoromethyl and diphenylpyridine with different bulk pendant groups

Tröger’s Base (TB)-Based Polyimides as Promising Heat-Insulating and Low- K Dielectric Materials

Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package

Polyimide Films with Liquid‐Crystal‐Like Structures: Toward Ultralow Dielectric Loss at High Frequencies

Polyimide Films Based on β-Cyclodextrin Polyrotaxane with Low Dielectric and Excellent Comprehensive Performance

Perfluorocyclobutyl-containing transparent polyimides with low dielectric constant and low dielectric loss