Abstract:A sustainable lithography paradigm enabled by mechanically peelable resists is demonstrated. This paradigm involves chemical‐free resist stripping, and 100%‐yield mechanical lift‐off, and enables reliable conformal manufacturing of transient electronics. Various exemplary demonstrations indicate this technology could potentially establish a standard lift‐off process for the pan‐semiconductor industry and open new avenues for the mass production of transient electronics and integrated biodegradable devices. Lithography is critical in micro‐ and nanofabrication processes, enabling the development of integrated circuits, semiconductor devices, and various advanced electronic and photonic systems. However, there are challenges related to sustainability, efficiency, and yield, as well as compatibility with transient electronics. This work introduces a sustainable lithography paradigm employing mechanically peelable resists compatible with existing cleanroom processes. The resists exhibit near‐zero adhesion to various substrates, facilitating efficient, cost‐effective, environmentally friendly, and chemical‐free mechanical stripping without observable particulate residues. The mechanical lift‐off process enables scalable and 100%‐yield pattern transfer using commercially available tape within seconds. Furthermore, the new paradigm supports distributed and in situ conformal manufacturing using the peelable resist as a "transferable stencil mask" to fabricate various functional devices on flexible and nonplanar surfaces, as well as ultra‐thin biodegradable substrates. Overall, this work expands the potential for using lift‐off as a standard process in the pan‐semiconductor industry and opens new avenues for lithographic procedures aimed at the reliable mass production of transient electronics and integrated biodegradable devices, addressing growing sustainability issues caused by electronic waste.

Optimized Wafer Edge Condition in Lithographic Process for Peeling Defect Reduction

Wafer Edge Process Integration and Defect Inspection with the Immersion Lithography Process

Optimization of Wet strip after Metal Hard Mask All-in-One Etch for metal void reduction and yield improvement

Methods of Reducing Metal Damager Defect in Back End of Line for Semiconductor in 28nm Technology

Competing Behavior of Interface Delamination and Wafer Cracking During Peeling Film from Ultra-Thin Wafer

Analysis of Linewidth Uniformity and Line Edge/Width Roughness in a 5 Nm Logic SAQP Process

The Defect Reduction of Via Opens by the Integration of Inter-Metal-Dielectric Film, Metal Hard Mask, and All-in-One Etch Processes

(Digital Presentation) Uniformity and Profile Improvement of Fin Etching Process at Wafer Extreme Edge for Finfet Mass Production

Mechanics Analysis and Experimental Study of Ultra-Thin Chip Peeling from Pre-Stretching Substrates

Lithography printability review: an application on advanced photomask production for enhancing mask yield and cycle time

Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing

Sustainable Lithography Paradigm Enabled by Mechanically Peelable Resists

EFFECT OF WAFER EDGE CUT ON TESTING AND YIELD

Metal corrosion and passivation swelling defect study of ultra low pattern density thick metal etch process

Novel Wafer Bevel Treatment for Water Immersion Lithography

Analysis of Interfacial Peeling in IC Chip Pick-Up Process

Research on Silicon Wafer Surface Phase under the Ultra-thin Slicing Process and Its Etching Hindrance Behavior during Metal-Assisted Chemical Etching

Theory and simulations of peel demolding for large-area nanoimprint lithography

Top Metal Layer Electro Plating Edge Bevel Removal Improvement Study

The Edge Effect in High Power RIE and Compensatory Approach

Optimization of approach for metal contamination reduction