Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing

Siyu Chen,Wenhan Lyu,Gang Wang,Ying Chen,Yinji Ma,Xue Feng

DOI: https://doi.org/10.1016/j.ijsolstr.2021.02.020

IF: 3.667

2021-08-01

International Journal of Solids and Structures

Abstract:<p>Chip peeling-off, mainly accomplished through the cooperation of needle-ejecting and vacuum-absorbing, plays a critical role in chip transferring process. However, there are few studies involving the quantification of process parameters, such as optimal needle position, needle force or displacement, to access to a reliable chip peeling. In this paper, optimization criteria for a high success rate of thin chip peeling-off are presented. With the cooperation of multi-needle-ejecting and vacuum-absorbing, the chip-adhesive-substrate structure is modeled within the framework of Timoshenko's beam theory, and the competing fracture behavior between chip cracking and peeling-off in the peeling process is analyzed. A dimensionless peeling health index <span class="math"><math>Γ</math></span>is proposed to evaluate the health status of the chip in the peeling process, and the effects of the needle position, the chip-adhesive-substrate structure geometry and material on the peeling health index are examined. On a basis of the numerical results, the optimal conditions for high-productivity peeling are achieved, which are the optimal needle position roughly at the edges of the chip, and the optimal shift point of changing the condition from needle-ejecting to vacuum-absorbing where the crack length in the adhesive layer expands to nearly the half value of the chip length. In addition, the expressions of the optimal ejecting needle force/displacement corresponding to the optimal shift point are obtained by the dimensionless analysis and fitting method. Furthermore, the optimization criteria including the optimal needle position and the optimal shift point of changing the condition from needle-ejecting to vacuum-absorbing are verified by experiments.</p>

mechanics

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the mechanical analysis in the process of ultra - thin chip peeling from the substrate under the synergy of multi - pin ejection and vacuum adsorption. Specifically, the paper focuses on how to optimize this process to improve the success rate of chip peeling and reduce the cracks that occur during the chip - peeling process. Through establishing a theoretical model of the chip - adhesive - substrate structure and combining experimental verification, the research explores the influence of pin positions, the geometry and material properties of the chip - adhesive - substrate structure on the peeling health index. The peeling health index is a dimensionless indicator used to evaluate the health state of the chip during the peeling process, thereby guiding how to select the optimal pin position and ejection force / displacement in actual operations to achieve high - efficiency and reliable chip peeling.