Abstract:Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.

Peeling Mechanics of Film-Substrate System with Mutually Embedded Nanostructures in the Interface

Exploiting Interfacial Instability During Peeling a Flexible Plate from Elastic Films

Competing Behavior of Interface Delamination and Wafer Cracking During Peeling Film from Ultra-Thin Wafer

Theory and simulations of peel demolding for large-area nanoimprint lithography

90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification

Study of the Demolding Process - Implications for Thermal Stress, Adhesion and Friction Control

Multi-peeling states of elastic film from flexible substrate

Peeling Behavior of a Film on Inner Surface of a Tube

IMPROVEMENT OF THE PEELING STRENGTH OF THIN FILMS BY A BIOINSPIRED HIERARCHICAL INTERFACE

Rate-dependent Peeling Behavior of the Viscoelastic Film-Substrate System

Electro-capillary peeling of thin films

Multiple kinds of peeling processes and instabilities in heterogeneous film peeling

Active Control of Surface Integrity in Thin Film Scratching and Finishing

Harnessing strong and asymmetric adhesion by combining film heterogeneity and substrate morphology

V-shaped Double Peeling of Films from Curved Rigid Substrates

Peridynamic Fracture Analysis of Film–substrate Systems

Effect of Interfacial Interaction on the Demolding Deformation of Injection Molded Microfluidic Chips

Thermally Assisted Peeling of an Elastic Strip in Adhesion with a Substrate Via Molecular Bonds

Micro-Scale Delaminating and Buckling of Thin Film on Soft Substrate

A wrinkling-assisted strategy for controlled interface delamination in mechanically-guided 3D assembly