Electro-capillary peeling of thin films

Peiliu Li,Xianfu Huang,Ya-Pu Zhao

DOI: https://doi.org/10.1038/s41467-023-41922-2

2023-04-20

Abstract:Thin films being a universal functional material have attracted much interest in academic and industrial applications, such as flexible electronics, soft robotics, and micro-nano devices. With thin films becoming micro/nanoscale, developing a simple and nondestructive peeling method for transferring and reusing remains a big challenge. Here, we present an innovative detaching approach for thin films: Electro-capillary peeling method. The electro-capillary peeling method achieves thin films' detachment by driving liquid to percolate and spread into the bonding layer under electric fields. Compared with traditional methods, thin film detached by this novel peeling mode shows a much lower deformation and strain of film (reaching 86%). Evaluated by various applied voltages and films, the electro-capillary peeling method shows active control characterizations and is appropriate in a broad range of films. Theoretically, it is demonstrated that the electro-capillary peeling method is actualized by utilizing Maxwell stress to compete with the film's adhesive stress and tension stress. The peeling length versus time, applied voltage, film's thickness, and elastic modulus are described by $r\sim t$, $r \sim U$, $r\sim d_{0}^{-1/2}$, and $r\sim E^{-1/2}$, respectively. Additionally, observations of critical peeling voltage present that the thin film is readily detached by using the electro-capillary peeling method at the ultra-low voltage of only 0.7 V. This work clearly shows the great potential of electro-capillary peeling method to provide a new way for transferring films and open novel routes for applications of soft materials.

Fluid Dynamics

What problem does this paper attempt to address?

The problem that this paper attempts to solve is how to develop a simple and non - destructive thin - film peeling method at the micro - and nano - scales to achieve the effective transfer and reuse of thin films. With the development of thin - film technology, especially the increasing demand for thin films in fields such as flexible electronics, soft robotics technology and micro - and nano - devices, traditional peeling methods are difficult to meet the needs of practical applications due to their complexity and limitations on the types of thin films. Therefore, the paper proposes an innovative peeling method - the Electro - capillary peeling method, aiming to overcome the limitations of existing methods and provide an efficient and controllable peeling means applicable to a wide range of thin - film types.

The Electro - capillary peeling method realizes the peeling of thin films by driving the liquid to penetrate and diffuse into the adhesive layer between the thin film and the substrate under the action of an electric field. This method is not only simple to operate, but also can effectively control the deformation and strain during the peeling process, and is especially suitable for thin - film materials with high adhesion. Through theoretical analysis and experimental verification, the paper shows the performance of this method under different voltages, film thicknesses and elastic modulus conditions, and proves that it can effectively peel the thin film even at an ultra - low voltage (only 0.7V), having broad application prospects.