CFET 6T HD SRAM Designs with 3nm Design Rule

Xiaona Zhu,RongZheng Ding,Yanli Li,Qiang Wu,Shaofeng Yu
DOI: https://doi.org/10.1109/cstic55103.2022.9856851
2022-01-01
Abstract:As the critical dimensions continue to shrink, CFET structures which have alternating NMOS and PMOS stacking structures have been widely considered as one of the main device structures after gate all around(GAA) devices. This paper gives two designs of 6T high density(HD) SRAM with (Complementary Field-Effect-Transistor) CFET unit. Compared to 9 Fin pitch (FP) cell height of GAA consisted 6T SRAM, our CFET design achieve 6FP and even a 5FP cell height, thus shrinking the cell area to ∼11520 nm2, 44.4% shrinking compared to GAA constructed SRAM. The resistance and capacitance performance of our 2 designs also discussed. The decreased BL and WL resistance and capacitance revealed that our CFET design could achieve better SRAM read and write speed. This work gives a comprehensively analysis including layout, process flow and device performance co-optimization.
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