Novel green chemical mechanical polishing of fused silica through designing synergistic CeO 2 /h-BN abrasives with lubricity
Jie Liu,Zhenyu Zhang,Chunjing Shi,Zheng Ren,Junyuan Feng,Hongxiu Zhou,Zhensong Liu,Fanning Meng,Shuming Zhao
DOI: https://doi.org/10.1016/j.apsusc.2023.157978
IF: 6.7
2023-07-09
Applied Surface Science
Abstract:It is a challenge to produce an atomic-scale surface of fused silica with a high material removal rate (MRR) using green chemical mechanical polishing (CMP). In traditional CMP, a slurry usually contains four or more components and is normally toxic and corrosive, causing environmental degradation. To address this problem, a novel green CMP slurry for fused silica was developed using ceria/hexagonal boron nitride (CeO 2 /h-BN) abrasives, potassium oleate, and deionized water. Due to the two-dimensional nanosheet structure of h-BN, it is simple to generate a sheared layer, which lowers friction at the contact area. Ceria abrasives realized a new function for superlubricity during CMP through this design, preventing damages and reaching atomic-scale surface. This is confirmed by research showing that a damaged layer's thickness following CMP, as determined by high-resolution transmission electron microscopy, is only 2.7 nm. The MRR of fused silica is 31.92 μm•h −1 during CMP, and surface roughness Sa is 0.124 nm after CMP. The MRR is currently at its highest with such a low surface roughness. These findings provide a new pathway to achieve an atomic-scale surface for a hard-brittle material with a high MRR using the synergistic effect of abrasives.
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films