Investigation on the Relationship Between Apparent Viscosity of Fe3O4@SiO2 Abrasive-Based Magneto-Rheological Fluid and Material Removal Rate of Sapphire in Magneto-Rheological Polishing

Quan Zhai,Wenjie Zhai,Bo Gao

DOI: https://doi.org/10.1016/j.colsurfa.2022.128420

2022-01-01

Abstract:The Fe3O4@SiO2 core-shell abrasive-based magneto-rheological (MR) fluid shows promising prospect for magneto-rheological polishing (MRP) of sapphire, so it is essential to investigate the influence of its rheological properties on polishing performance of sapphire. This paper proposed an original self-assembled apparatus to measure normal force, shear force and interface area between MR ribbon and sapphire wafers during polishing, then evaluated systematically the separation rate and dynamic viscosity of Fe3O4/SiO2 abrasive-based MR fluid under various working parameters. Furthermore, the correlation between apparent dynamic viscosity of MR ribbon and the material removal rate (MRR) of sapphire was investigated. The results showed that both normal force and shear force generated on sapphire surface increase with abrasives concentration and shear velocity, while decrease with excitation distance and working distance. Both apparent dynamic viscosity and separation rate of MR ribbon decrease with working distance. The dynamic viscosity of MR ribbon increases significantly with magnetic field strength, and the larger the fraction of abrasive volume, the higher its increasing slope. The MRR of sapphire wafer increases with dynamic viscosity of MR ribbon, which shows a notably linear correlation, while the Ra value of wafer surface decreases with dynamic viscosity of MR ribbon. The largest MRR (0.323 mg/h) and the lowest Ra (2.21 nm) were achieved when the dynamic viscosity of MR ribbon was 15.33 Pa.s.