Novel Method for Improving Process Repeatability of the AlN Buffer Layer

Libin Zhang,Rongjun Zhang,Bo Yang,Sheng Liu,Zhiyin Gan
DOI: https://doi.org/10.1021/acs.cgd.1c00384
IF: 4.01
2021-01-01
Crystal Growth & Design
Abstract:A predeposition GaN process is innovatively proposed to solve the process repeatability problem of AlN buffer layer growth. First of all, it was speculated that the predeposited materials that may be present are Al, Ga, AlN, and GaN based on the introduced reaction sources. Then, the adsorption rate of each substance on the AlN surface was calculated and compared through theoretical derivation and first-principles calculation. We found that the adsorption rates of Al, Ga, AlN, and GaN on AlN surfaces are all in the same order of magnitude, indicating that Al, AlN, Ga, and GaN may coexist and affect the repeatability of the AlN film growth process together. Then, a process for suppressing impurities during AlN film growth was proposed: GaN is predeposited in the reaction chamber before the AlN film is grown, so that Al, Ga, or AlN remaining in the chamber when the AlN or AlGaN film is grown before is covered to create a single growth environment. To verify the effectiveness and reliability of this process, the reflectivity curve and crystal quality of AlN were compared. The result reveals that the GaN predeposition process can effectively improve the repeatability of AlN buffer layer growth. Moreover, the crystal quality of AlN is improved as well.
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