Abstract:Digital image correlation (DIC) is of vital importance in the field of experimental mechanics, yet producing suitable DIC patterns for demanding in‐situ (micro)mechanical tests remains challenging, especially for ultrafine patterns, despite the large number of patterning techniques reported in the literature. Therefore, we propose a simple, flexible, one‐step technique (only requiring a conventional physical vapour deposition machine) to obtain scalable, high‐quality, robust DIC patterns, suitable for a range of microscopic techniques, by deposition of a low‐melting temperature solder alloy in the so‐called island growth mode, without elevating the substrate temperature. Proof of principle is shown by (near‐)room temperature deposition of InSn patterns, yielding highly dense, homogeneous DIC patterns over large areas with a feature size that can be tuned from as small as ~10 nm to ~2 μm and with control over the feature shape and density by changing the deposition parameters. Pattern optimisation, in terms of feature size, density, and contrast, is demonstrated for imaging with atomic force microscopy, scanning electron microscopy, optical profilometry, and optical microscopy. Moreover, the performance of the InSn DIC patterns and their robustness to large deformations is validated in two challenging case studies of in‐situ micromechanical testing: (a) self‐adaptive isogeometric digital height correlation of optical surface height profiles of a coarse, bimodal InSn pattern providing microscopic 3D deformation fields (illustrated for delamination of Al stretchable interconnects on a PI substrate) and (b) DIC on scanning electron microscopy images of a much finer InSn pattern allowing quantification of high strains near fracture locations (illustrated for rupture of a polycrystalline Fe foil). As such, the high controllability, performance, and scalability of the DIC patterns, created by island growth of a solder alloy, offer a promising step towards more routine DIC‐based in‐situ micromechanical testing.

Surface Patterning Allowing Combined EBSD and DIC Investigations During In-Situ Deformation Experiments

Surface Patterning for Combined Digital Image Correlation and Electron Backscatter Diffraction In-Situ Deformation Experiments

A Feasible Surface Patterning Method for SEM-DIC: Achieving High-Resolution In Situ Mapping of Local Strain and Microstructure to Reveal the Effect of Slip Transfer on Shear Strain Near Grain Boundaries

Surface Patterning for Multi-Scale Strain Analysis of In-Situ Sem Mechanical Experiments

In-situ Study of Microstructural Evolution and Local Strain Distribution During Tensile Loading of Near-Micrometre Grain Size Aluminium

Nanoscale speckle patterning for combined high‐resolution strain and orientation mapping of environmentally sensitive materials

One-step deposition of nano-to-micron-scalable, high-quality digital image correlation patterns for high-strain in-situ multi-microscopy testing

Quantifying surface deformation around micrometer-scale indents by digital image correlation

Nanoscale Deformation Analysis With High-Resolution Transmission Electron Microscopy and Digital Image Correlation

Investigation of Medium to High Strain Deformation Microstructures Using an Automated Electron Backscattering Pattern (EBSP) System

In-situ EBSD Study of the Active Slip Systems and Lattice Rotation Behavior of Surface Grains in Aluminum Alloy During Tensile Deformation

Local Deformation Mechanisms in Metal Systems with a Tailored Grain Size Distribution

A Non-Intrusive Fluorescent Pattern for Internal Microscale Strain Measurements Using Digital Image Correlation

Fabrication of a DIC Sensor for In-Plane Deformation Measurement

Calibration of crystal orientation and pattern center of EBSD using integrated digital image correlation

Investigation of Grain Subdivision at Very Low Plastic Strains in A Magnesium Alloy

Time-Resolved Digital Image Correlation in the Scanning Electron Microscope for Analysis of Time-Dependent Mechanisms

Deformation Microstructures in Individual Cold Sprayed Al-Cu Alloy Particles Studied Via Precession Electron Diffraction and Transmission Kikuchi Diffraction

Nanoscale In-Plane Displacement Evaluation by AFM Scanning and Digital Image Correlation Processing

Note: Dynamic Strain Field Mapping with Synchrotron X-ray Digital Image Correlation.

In-situ Study of the Effect of Strain Path Change on Dislocation Boundary Evolution in Commercial Purity Aluminum