Abstract:Scanning electron microscopy‐based high‐resolution digital image correlation (HRDIC) is now an established technique, providing full‐field strain and displacement measurement at the microscale. Techniques for generating speckle patterns for sub‐micron strain mapping can often be either substrate dependent or rely on applying aggressive conditions which may alter the microstructure of interest or damage the substrate in highly sensitive materials. We detail a modification of a methodology successfully applied in the literature to allow its use with metallic materials that are particularly sensitive to the corrosive media, such as copper‐base alloys. Nanometre‐thick silver films, applied with physical vapour deposition, are remodelled using NaBr in non‐aqueous isopropanol, replacing the aqueous solution of NaCl in the original method, forming a uniform dispersion of silver islands highly suitable for digital image correlation (DIC) measurement. The entire procedure is performed at ambient temperature. We find that the DIC pattern is suitably electron transparent to allow electron backscatter diffraction (EBSD) measurements without pattern removal, producing diffraction patterns of sufficient quality for cross‐correlation based high‐angular resolution EBSD. This property facilitates simultaneous EBSD and DIC mapping experiments, providing deeper insights into the kinematics of plastic deformation in crystalline materials. Sub‐100 nm islands are achieved through control of the sputter coating parameters, resulting in DIC cross‐correlation subwindows of 140 nm with a 50% overlap. This resolution is sufficient to capture the fine detail of strain localisation phenomena during plastic deformation, demonstrated here with a case study in CuCrZr, a precipitation‐hardened heat sink material for application in nuclear fusion components. Here, we extract full‐field displacement data with DIC and corresponding orientation information using EBSD without the need for pattern removal.

Nanoscale Deformation Analysis With High-Resolution Transmission Electron Microscopy and Digital Image Correlation

Nanoscale In-Plane Displacement Evaluation by AFM Scanning and Digital Image Correlation Processing

Time-Resolved Digital Image Correlation in the Scanning Electron Microscope for Analysis of Time-Dependent Mechanisms

Nanoscale speckle patterning for combined high‐resolution strain and orientation mapping of environmentally sensitive materials

Surface Patterning for Multi-Scale Strain Analysis of In-Situ Sem Mechanical Experiments

Surface Patterning for Combined Digital Image Correlation and Electron Backscatter Diffraction In-Situ Deformation Experiments

Nanoscale defect evaluation framework combining real-time transmission electron microscopy and integrated machine learning-particle filter estimation

Scanning-Digital Image Correlation for Moving and Temporally Deformed Surfaces in Scanning Imaging Mode

Note: Dynamic Strain Field Mapping with Synchrotron X-ray Digital Image Correlation.

In Situ Scanning–digital Image Correlation for High-Temperature Deformation Measurement of Nickel-Based Single Crystal Superalloy

A Feasible Surface Patterning Method for SEM-DIC: Achieving High-Resolution In Situ Mapping of Local Strain and Microstructure to Reveal the Effect of Slip Transfer on Shear Strain Near Grain Boundaries

Distortion Correction Protocol for Digital Image Correlation after Scanning Electron Microscopy: Emphasis on Long Duration and Ex-Situ Experiments

Digital Rotation Moiré Method for Strain Measurement Based on High-Resolution Transmission Electron Microscope Lattice Image

Atomic-Scale-Deformation-Dynamics (asds) of Nanowires and Nanofilms

Surface Patterning Allowing Combined EBSD and DIC Investigations During In-Situ Deformation Experiments

Application of Digital Image Correlation (DIC) to the Measurement of Strain Concentration of a PVA Dual-Crosslink Hydrogel Under Large Deformation

3D Strain Measurement of Heterostructures Using the Scanning Transmission Electron Microscopy Moire Depth Sectioning Method

Model-Based Digital Image Correlation for Noncontact Deformation Measurement of Strain Field and Mechanical Property

High-Temperature Digital Image Correlation Method for Full-Field Deformation Measurement at 1200 Degrees C

Deformation analysis in microstructures and micro-devices

Envelope Element Local Digital Image Correlation Method for Crack Tip Deformation Field Measurement