Model-Based Digital Image Correlation for Noncontact Deformation Measurement of Strain Field and Mechanical Property

Jingjing Ji,Kok-Meng Lee,Yang Huang
DOI: https://doi.org/10.1109/TII.2019.2896167
IF: 12.3
2019-01-30
IEEE Transactions on Industrial Informatics
Abstract:This paper presents a new method that combines a physics-based model and finite-element (FE) based digital image correlation (DIC) with an interfacial continuity condition for simultaneous deformation measurements of strain field and material mechanical properties. The dual-domain global DIC method incorporates a model-based kernel that offers useful physical insights into the complex deformation and constrains the solutions to the iterative minimization of the DIC criterion, which leads to a faster convergence. Unlike local subset-based and global FE-based methods where the DIC is formulated to solve for the nodal displacements, the model-based DIC that accounts for complex deformation in the specific region is formulated to identify system parameters. Both domains, along with their interface and the continuity condition enforced on the global displacement field, are discretized and solved simultaneously in a single calculation. The dual-domain global DIC method has been investigated by comparing reconstructed strain fields and estimated parameters against targets simulated using the commercial FEA software COMSOL and published experimental data. Unlike FE-DIC which is noise sensitive, the model-based DIC is robust against the Gaussian noise effects.
Engineering,Materials Science,Computer Science,Physics
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