Flexible Thermal Interface Materials Through Controlling the Ratio of Silicone Oil Functional Groups

Wendian Tu,Linlin Ren,Guoping Du,Rong Sun,Xiaoliang Zeng,Junwei Li
DOI: https://doi.org/10.1109/icept52650.2021.9568112
2021-01-01
Abstract:Thermal interface materials (TIMs) have become important due to the development of electronic devices towards high integration. The materials face dilemmas of thermal conductivity and flexibility. Herein, we demonstrate a kind of TIMs via a simple method, which exhibits excellent elongation at break of 114.%, high thermal conductivity of 4.3 W.m-1: K−1, and low viscosity of 254 Pa.s. In addition, it exhibits great potential in the future and emerging applications such as wearable electronics since it is cost-effective and economical.
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