Flexible thermal conductive Al 2 O 3 @siloxane composite with rapid self-healing property based on carboxyl-amine dynamic reversible bonds

Ziyue Hu,Weijian Wu,Xiang Chen,Yuanzhou Chen,Junlin Chen,Zhifeng Hao

DOI: https://doi.org/10.1039/d1ra09367c

IF: 4.036

2022-01-01

RSC Advances

Abstract:Thermal interface materials (TIMs) are one of the efficacious ways to alleviate the heat accumulation problem of microelectronics devices.

chemistry, multidisciplinary

What problem does this paper attempt to address?

Robust, Self‐Healing, and Multi‐Use Poly(Urethane‐Urea‐Imide) Elastomer as a Durable Adhesive for Thermal Interface Materials

Zhiqiang Wu,Jie Dong,Han Guo,Rui Shang,Xiuzhi Qin,Yanfei Xia,Xiuting Li,Xin Zhao,Chengchang Ji,Qinghua Zhang

DOI: https://doi.org/10.1002/smll.202401815

IF: 13.3

2024-04-06

Small

Abstract:A novel poly(urethane‐urea‐imide) elastomer is synthesized, which successfully combines high toughness (117.3 MJ m−3), strong bonding strength on the metal substrate (7.39 MPa), and efficient self‐healing capability at room temperature. When composited with hybrid fillers of aluminum nitride/liquid metal for use as an adhesive‐type thermal interface material, it achieves a low thermal contact resistance of 22.1 mm2 K W−1 at zero pressure. Currently, research on thermal interface materials (TIMs) is primarily focused on enhancing thermal conductivity. However, strong adhesion and multifunctionality are also important characteristics for TIMs when pursing more stable interface heat conduction. Herein, a novel poly(urethane‐urea‐imide) (PUUI) elastomer containing abundant dynamic hydrogen bonds network and reversible disulfide linkages is successfully synthesized for application as a TIM matrix. The PUUI can self‐adapt to the metal substrate surface at moderate temperatures (80 °C) and demonstrates a high adhesion strength of up to 7.39 MPa on aluminum substrates attributed its noncovalent interactions and strong intrinsic cohesion. Additionally, the PUUI displays efficient self‐healing capability, which can restore 94% of its original mechanical properties after self‐healing for 6 h at room temperature. Furthermore, PUUI composited with aluminum nitride and liquid metal hybrid fillers demonstrates a high thermal conductivity of 3.87 W m−1 K−1 while maintaining remarkable self‐healing capability and adhesion. When used as an adhesive‐type TIM, it achieves a low thermal contact resistance of 22.1 mm2 K W−1 at zero pressure, only 16.7% of that of commercial thermal pads. This study is expected to break the current research paradigm of TIMs and offers new insights for the development of advanced, reliable, and sustainable TIMs.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Multiway Softness Polyurethane Elastomeric Composite with Enhanced Thermal Conductivity and Application as Thermal Interface Materials

Wei Zhou,Weixuan Wang,Hengyi Shi,Xiaoliang Zeng,Junhong Li,Yunsong Pang,Yu‐Chung Chang,Rong Sun,Linlin Ren

DOI: https://doi.org/10.1002/admt.202201701

IF: 6.8

2023-02-04

Advanced Materials Technologies

Abstract:Polyurethane elastomer composites with high thermal conductivity and tunable softness for thermal interface materials (TIMs), by introducing dynamic imine bonds of Schiff base along with the lengthening of the Khun segment in the crosslinking network, endowing TIMs with temperature‐tunable softness function while maintaining high thermal conductivity. Meanwhile, Schiff base used for the preparation of TIMs is renewable. The ever‐increasing computing power in modern electronics comes with significant heat waste that can't be ignored. For microchips to dissipate heat efficiently, thermal interface materials (TIMs) are the most critical components in semiconductor packaging. Soft elastomer composites are often used as TIMs due to their large‐strain reversible deformability with a small external force. For TIMs to cushion between the microchip and heat spreader, they must have high thermal conductivity and temperature‐tunable softness to reduce thermal resistance and relieve the warpage failure caused by thermal stress. However, thermal conductivity and softness are interrelated and restrict each other. To address this challenge, a radical strategy of introducing dynamic covalent bonds in the polyurethane/aluminum composite is used. The reversible and low energy of dynamic imine bonds along with the lengthening of the Khun segment in the crosslinking network imbues the material with temperature‐tunable softness function while maintaining high thermal conductivity. The resulting polyurethane elastomer (PUE) composite exhibits remarkable thermal conductivity (6.90 W m−1 K−1), low thermal resistance (0.13 K cm2 W−1), and excellent softness (elastic modulus 759.50 kPa, and stretchability 140.30%). This work provides a practical method to design thermally conductive and temperature‐tunable soft elastomer composites as TIMs in semiconductor packaging.

materials science, multidisciplinary
Robust, self-healable, recyclable and thermally conductive silicone composite as intelligent thermal interface material

Ziqian Lin,Hao Jin,Haoyu Deng,Zhaoji Zu,Haiqing Huang,Lanyue Zhang,Hongping Xiang

DOI: https://doi.org/10.1016/j.compstruct.2024.117932

IF: 6.3

2024-01-26

Composite Structures

Abstract:The facile preparation of robust, thermally conductive, self-healable and recyclable silicone composite is still a major challenge, so an asymmetric dynamic crosslinking chain strategy is proposed herein. Due to the better synergy of dynamic covalent and non-covalent bonds, this crosslinked network designed increases the tensile strength of silicone elastomer by 3 times to 5.1 MP, compared to traditional symmetric crosslinking structures (1.7 MPa). Moreover, optimizing the size and content of thermally conductive fillers (Al 2 O 3 and BN), the thermal conductivity of silicone composite reaches 2.9 W/mK, vitalizing the rapid heat conduction and dissipation. Moreover, the composite can be repeatedly self-healed and reprocessed, its tensile strength and thermal conductivity recover 95%. The composite can also be recycled into silicone matrix and fillers, and the recycled materials can be remolded into new composite, allowing the recycling of electronic devices. Therefore, this work opens new avenues for intelligent thermal management in electronic devices.

mechanics,materials science, composites
Enhanced interfacial heat-transfer of Al2O3-MXene-silicone composite via an electrostatic self-assembly strategy

Zhenqiang Ye,Chao Ji,Tao Yu,Rong Sun,Xiaoliang Zeng,Bingyang Cao

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2022.123430

IF: 5.2

2022-12-15

International Journal of Heat and Mass Transfer

Abstract:Thermal interface materials (TIMs) are indispensable materials in thermal management, and Al2O3-based TIMs are most widely used in thermal managements. Surface modification is an effective method to improve Al2O3 dispersion in matrix, thereby increasing the maximum filler loading. However, traditional surfactants hardly promote the interfacial heat-transfer on the premise of the same filler loading. In this work, we proposed an electrostatic self-assembly strategy to functionalize the surface of Al2O3 particles with MXene sheets to enhance the interfacial heat-transfer between fillers and silicone rubber (SR). To validate the effectiveness of MXene, we compared the Al2O3-MXene-SR TIM with Al2O3-graphene-SR TIM and Al2O3-SR TIM under the same Al2O3 loading in the aspects of mechanical properties and thermal properties. Though MXene could increase the viscosity and hardness, the negative influence of MXene is much weaker than that of graphene. Nevertheless, the positive impact of MXene is more significant. First, it can reinforce the mechanical strength. The experiment showed the breaking tensile strength of the Al2O3-MXene-SR TIM is 0.117 MPa, higher than that of the Al2O3-graphene-SR TIM (0.082 MPa) and the Al2O3-SR TIM (0.07 MPa). Second, the thermal conductivity of TIMs improves a lot after MXene coating. The thermal conductivity of Al2O3-MXene-SR TIM is 3.4 W·m−1·K−1, with the matrix/filler mass ratio of 100:1600, which is 30% higher than that of the Al2O3-SR TIM (2.6 W·m−1·K−1) and 21% higher than that of Al2O3-Gr-SR TIM (2.8 W·m−1·K−1). Whereas the Al2O3 loading keeps the same and the MXene fraction is only about 1.16 vol‰, the increment of the thermal conductivity is mostly due to the improvement of interfacial heat-transfer via MXene. The temperature cycling test and aging test implied that the Al2O3-MXene-SR TIM is thermally stable and reliable. The underlying mechanism of the interfacial heat-transfer enhancement was revealed by the analysis of phonon density of states (PDOS) via a molecular dynamics simulation. The PDOS of MXene is more compatible with Al2O3 and SR than graphene, so MXene sheets play the role as a bridge between Al2O3 and SR to improve the interfacial phonon transport. This work provides an effective method to reduce interfacial thermal resistance in TIMs, which could facilitate the development of thermal management materials.

engineering, mechanical,thermodynamics,mechanics
Alveoli‐Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High‐Performance Thermal Interface Materials

Sijia Zheng,Haiyan Xue,Ying Liu,Xing Yu,Zhihai Cao

DOI: https://doi.org/10.1002/smll.202306750

IF: 13.3

2023-12-04

Small

Abstract:Inspired by alveoli structure, thermally conductive composites are designed with excellent comprehensive performances. The synergistic effect of the liquid metal and graphite boosts the thermally conductive performance of the composites. Due to the elaborate structure, the designed composites present excellent comprehensive performance, including low density, low Young's modulus, and large‐scale processing capability. Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high‐performance TIM inspired by alveoli is proposed. The material design includes the self‐alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) ‐the alveoli; and a small amount of liquid metal (LM) – capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34 W m−1 K−1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long‐term applications. The thermally conductive, soft, and lightweight composites are believed to be high‐performance silicone bases TIMs for advanced electronics.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Comprehensive excellent performance for silicone-based thermal interface materials through the synergistic effect between graphene and spherical alumina

Cheng Chen,Yan He,Changqing Liu,Huaqing Xie,Wei Yu

DOI: https://doi.org/10.1007/s10854-020-03016-3

2020-02-08

Abstract:Rapid heat dissipation is the pain point of modern miniaturized electronic equipment and components. High-power and high-efficiency operation puts forward higher requirements on the heat transfer capability of thermal interface materials (TIM). In this work, taking advantage of synergistic effect between thermally conductive fillers graphene and alumina (Al2O3), thermal grease-based TIM was prepared. Secondly, the effects of temperature and pressure on the thermal interface resistance were studied. Lastly, coating thickness and thermal stability of thermal grease-based TIM were tested. These results show thermal conductivity of composite as high as 4.38 W/(m K). The interface thermal resistance is as low as 0.243 °C cm2/W (80 °C, 60 psi) in case that the temperature and pressure strain capability within a certain range are subsequently considerable. Furthermore, the oil leakage is fractional when the silicone grease was placed at 80 °C for 600 h, showing good thermal stability.
Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy

Zilong Xie,Zhengli Dou,Die Wu,Xiangtong Zeng,Yuan Feng,Yunfei Tian,Qiang Fu,Kai Wu

DOI: https://doi.org/10.1002/adfm.202214071

IF: 19

2023-01-24

Advanced Functional Materials

Abstract:A joint‐inspired interfacial engineering strategy is reported through on‐demand employing liquid metal to alumina by a scalable mechanochemical process, leading the original hard and non‐conductive polymer–alumina interface change into the liquid yet thermal conductive counterpart. It successfully resolves the traditional paradox that thermal conductivity and contact thermal resistance of a thermal interface material is hardly improved simultaneously. For advanced thermal interface materials (TIMs), massive inorganic addition for high isotropic thermal conductivities conflicts with suitable rheological viscosity for low contact thermal resistance. Traditional strategies rarely resolve such a contradiction, and it remains an academic and industrial challenge. Herein, inspired by the structure and function of the bone joint, a best‐of‐both‐worlds approach is reported that endows a standard polydimethylsiloxane/alumina (PDMS/Al2O3) TIM with simultaneously enhanced rheological mobility and thermal conductivity. It is conducted by employing morphology‐controllable gallium‐based liquid metal (LM) to the surface of Al2O3 by a scalable mechanochemical process. At the typical polymer‐LM‐Al2O3 interface, LM droplets with low cohesive energy can release the freedom for macromolecular chain relaxation and reduce the viscosity, successfully allowing the high‐loading TIMs (79 vol.%) to keep the thixotropic state and effectively reducing its contact thermal resistance with a copper substrate by 65%. At the same time, adjacent LMs merge to thermally bridge separate Al2O3 particles, which facilitates the interfacial thermal conduction and enhances the thermal conductivity from 5.9 to 6.7 W m−1 K−1. Along with additional electrical insulation, this filler modification strategy is believed to inspire others to develop high‐performance polymer‐based TIMs for future advanced electronics.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
Anti-leak, self-adaptive liquid metal-epoxy in-situ cured composites with ultra-low thermal resistance via flexible droplet inclusions

Xiao Jia,Shijun Wang,Shikun Li,Cui Xu,Jun Du,Jingzhi Zhou,Ziyang Cheng,Feng Zhou,Yamin Deng,Bin Liu,Xiulan Huai

DOI: https://doi.org/10.1016/j.surfin.2023.103335

IF: 6.2

2023-09-08

Surfaces and Interfaces

Abstract:Generally, the function of thermal interface material (TIM) is filling rough surfaces, eradicating air pockets, decreasing thermal resistance, and improving heat dissipating effects. On this basis, we provide the TIM with another identity, "adhesion", rendering it not only play a role of heat dissipation, but also serve as an adhesive to bond contacting surfaces. In this work, nano- to microscopic liquid metal (LM) droplets are embedded into the epoxy matrix to fabricate a LM-epoxy in-situ cured composite. By adding the curing agent, the LM-epoxy composite is cured into an entity structure, transforming from an amorphous grease state to a self-adaptive pad state. When the average droplet size is in a reasonable range of approximately 5–25 μm, the composite's thermal resistance ( R total ) decreases to 2.19 mm 2 K/W at 70% volume fraction with its adhesive strength of 0.497 MPa, and the thermal conductivity ( k TIM ) could increase to 10.05 W/(m·K) at 85%. Both R total and k TIM change rapidly for droplet size approximately ranging from 10 2 nm to 10 1 μm and then tend to level off when it further increases to 10 2 μm. A conception of equivalent contact thickness, δ, is presented to elucidate the contacting thermal resistance R c , and set up predictive models of R total for different volume fractions by considering the microscopic interfacial thermal resistance R b between filler and matrix or not. This composite simultaneously possesses characteristics of the low thermal resistance like thermal grease, the whole entity like thermal pad, and the anti-leak characteristics by in-situ cured process. Actual cooling tests show it has a considerable temperature difference of 4.75 °C lower than the commercial thermal grease at 650 W heating power. This in-situ cured strategy, via decreasing the thermal resistance and solving the problem of LM leakage, remarkably promotes the LM-TIMs achieving a broader application prospect in the future.

chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
High-performance non-silicone thermal interface materials based on tunable size and polymorphic liquid metal inclusions

Xiao Jia,Bin Liu,Shikun Li,Xunfeng Li,Jingzhi Zhou,Guohui Zhou,Shijun Wang,Min Xu,Cui Xu,Jun Du,Yamin Deng,Xiulan Huai

DOI: https://doi.org/10.1007/s10853-022-07210-y

IF: 4.5

2022-06-04

Journal of Materials Science

Abstract:Incorporating liquid metal droplets into polymer matrix has become one of the most promising strategies to enhance the thermally conductive performance of thermal interface materials (TIMs) for the escalating heat dissipation demands from highly integrated electronic devices. However, most of the TIMs typically choose silicone polymer as the matrix material, which would exhibit silicone oil precipitation and siloxane evaporation after long time utilization. Here, we present a non-silicone TIM with efficient heat dissipation capability by incorporating multi-shaped and proper-sized liquid metal droplets into an epoxy matrix via a combined fabrication approach. This liquid metal epoxy composite (LMEC) exhibits a high thermal conductivity enhanced up to 14 W (nearly 78 increase over the matrix) at 85% volume fraction and an ultra-low thermal resistance of 0.0043 K at 65% volume fraction. Its Kapitza radius and thermal interfacial resistance are estimated from the experimental results, respectively, about 75 nm and K , which helps explaining the reduced thermal conductivity of composites with small droplet inclusions. Moreover, actual cooling tests on a high power heating device demonstrate that 65% LMEC shows superior cooling effects than the non-silicone TIMs of indium foil, pure liquid metal, 85% LMEC, and the silicone oil-based liquid metal composites of 65 and 85% volume fraction, which indicate that not the TIMs with higher intrinsic thermal conductivity would exhibit superior heat dissipation effects, but those possessing low thermal resistance between the heat source and heat sink show better heat transfer properties.

materials science, multidisciplinary
Improving through-plane thermal conductivity of PDMS-based composites using highly oriented carbon fibers bridged by Al2O3 particles

Ruoyu Huang,Dongliang Ding,Xiaoxiao Guo,Changjiang Liu,Xinhua Li,Gaoxiao Jiang,Yufeng Zhang,Yanhui Chen,Weiwei Cai,Xue-ao Zhang

DOI: https://doi.org/10.1016/j.compscitech.2022.109717

IF: 9.1

2022-11-10

Composites Science and Technology

Abstract:Efficient thermal interface materials (TIMs) are urgently needed for heat dissipation of high-power density electronics. In this study, vinyl polydimethylsiloxane (PDMS) composites with the spatial alignment of carbon fibers (CFs) bridged by Al2O3 particles were fabricated by the flow field. The through-plane thermal conductivity (TPTC) of the composites with 24 vol% CFs and 47 vol% Al2O3 loading reached 38.0 W m−1 K−1. The oriented CFs bridged by Al2O3 acted as the efficient through-plane thermal conductive network. Furthermore, the effects of shape factor (b/a), spatial angle (γ) of CFs, and CF loading (Vf) on the TPTC were quantitatively discussed by steady-state finite element simulation combined with micro-computed tomography and machine learning. The positive contribution of the increased Vf to TPTC was in competition with the negative contribution of b/a and γ, both of which increased with the increase of Vf. Moreover, b/a exerted more negative effects than γ. The PDMS composites demonstrated excellent thermal stability (Td = 407.5 °C, CTE = −55.3 × 10−6 K−1), low compress modulus (1.71 MPa), and hardness (47 (Shore C)), which made them potential candidates for TIMs. This work offers a feasible method to prepare TIMs on large scale and refreshes the thermal conduction mechanism of TIMs by introducing the influencing factors (b/a and γ).

materials science, composites
A Fast and Room-temperature Self-healing Thermal Conductive Polymer Composite

De-Wei Yue,Hong-Qin Wang,Han-Qing Tao,Peng Zheng,Cheng-Hui Li,Jing-Lin Zuo

DOI: https://doi.org/10.1007/s10118-021-2620-1

2021-07-25

Chinese Journal of Polymer Science

Abstract:Thermal conducting materials may be damaged during long-term use, resulting in the increase of thermal resistance and therefore inefficient heat dissipation. The introduction of self-healing ability may solve this problem, but the realization of fast and room-temperature self-healing in thermal conducting composites is quite challenging. Herein, we choose a flexible poly(dimethylsiloxane) polymer material (PDMS-COOH) as the matrix and graphene nanosheets as the thermal conductive filler to prepare a new kind of thermal conductive polymer composite (PDMS-COOH-CG) that can quickly self-heal at room temperature. The thermal conductivity of PDMS-COOH-CG10 with 10% of graphene content is 0.48 W·m−1·K−1, which is 16 times that of PDMS-COOH (0.03 W·m−1·K−1). At room temperature, self-healing efficiency of PDMS-COOH-CG10 based on tensile strength can be 53.8% for 30 s and 84.6% for 24 h. Dynamic infrared thermal imaging dipicted that after 2 min of self-healing at room temperature, the thermal conduction temperature near the damage was basically restored to the level of the pristine sample.

polymer science
Flexible Polytetrafluoroethylene (PTFE) Composite Film with Enhanced Thermal Conductivity and Low Interface Thermal Resistance for High Frequency Electronics

Huichao Du,Chao Xiao,Miao Jiang,Xusheng He,Yanyan Wang,Xin Ding,Xian Zhang,Xiaofei Li,Kang Zheng,Xianglan Liu,Lin Chen,Meng Xue,Xingyou Tian,Hui Zhang

DOI: https://doi.org/10.1016/j.polymer.2023.126367

IF: 4.6

2023-01-01

Polymer

Abstract:The significant degradation in mechanical properties and filling-gap performance of thermal interface materials (TIMs) under high filling ratios remained a prevalent problem. Here, a polytetrafluoroethylene (PTFE) based composite film with excellent flexibility at ultra-high hybrid fillers content (up to 90 wt%) was developed through the mechanical interlocking strategy. Due to the sufficient fibrosis of PTFE under shear stress, boron nitride (BN) and aluminum nitride (AlN) were firmly constrained inside the fiber cage. The hybrid fillers arranged into a seesaw-like structure during the calendering process, which facilitated the formation of thermal conductive network in both horizontal and vertical directions. Importantly, this unique embedded structure allowed for direct contact between the fillers and the heat source, resulting in a 90.45% decrease in interfacial thermal resistance. The resultant film possessed a high thermal conductivity (4.3 W/m & sdot;K, in-plane, 0.75 W/m & sdot;K, out-plane), low dielectric constant (3.1, 10 GHz), and excellent flexibility, making it suitable for application of interface heat dissipation in high-frequency electronic devices.
PDMS/functionalized h-BN/liquid metal flexible composite with dual-network structure for achieving superior thermal conductivity and low thermal resistance via interfacial grafting

Junhui Fan,Dahai Zhu,Yifan Li,Changqing Liu,Huaqing Xie,Wei Yu

DOI: https://doi.org/10.1016/j.icheatmasstransfer.2024.107331

IF: 6.782

2024-03-01

International Communications in Heat and Mass Transfer

Abstract:Thermal interface materials (TIMs) play a crucial role in addressing the heat dissipation challenges associated with high-power electrical equipment. Apart from possessing excellent thermal conductivity, and they must also exhibit low contact thermal resistance to facilitate efficient heat transfer at the interface. In this study, a novel composite with a dual-network structure was prepared by interfacial grafting to achieve superior thermal conductivity. The composite comprises polydimethylsiloxane (PDMS), functionalized boron nitride ( f -BN), and liquid metal (LM). This dual network structure effectively enhances phonon transportation and significantly improves the thermal transport performance of the composite. The thermal conductivity of the obtained composite can achieve 4.4 W/m·K, accompanied by a low contact thermal resistance of 0.32 °C·cm 2 /W. Furthermore, the dual network structure ensures the flexibility of the composite, as evidenced by the maximum elongation reaching 267.43% at a tensile strength of 0.35 MPa. This exceptional mechanical performance is expected to alleviate stress concentration issues arising from thermal expansion mismatch, thereby enhancing the practical applicability of the prepared TIMs. Overall, this study introduces a novel approach for fabricating flexible composites with high thermal conductivity and low contact thermal resistance, offering new insights into the preparation of TIMs.

thermodynamics,mechanics
Thermally conductive, self-healing, and elastic Polyimide@Vertically aligned carbon nanotubes composite as smart thermal interface material

Huitao Yu,Yiyu Feng,Can Chen,Zhixing Zhang,Yu Cai,Mengmeng Qin,Wei Feng

DOI: https://doi.org/10.1016/j.carbon.2021.04.055

IF: 10.9

2021-07-01

Carbon

Abstract:Smart thermal interface materials must exhibit self-healability and high thermal conductivity (k) and elastic deformation as they can experience repeated compression and undergo sudden damage. However, it remains challenging to ensure high phonon mobility/efficient phonon transfer, self-healing, and good elasticity by optimizing its molecular orientation or cross-links. Herein, a self-healing and elastic polyimide copolymer (EMPI) cross-linked by flexible and rigid segments is uniformly filled into the gaps of a forest of vertically aligned carbon nanotubes (VACNTs). The composite exhibits a high k value at 10.83 ± 0.22 W m−1 K−1, low interfacial thermal resistance at 6.83 ± 0.15 K mm2 W−1, high elastic compressive deformation (30% at 2.5 MPa), and strong surface adhesion (0.3 MPa). Further, it could recover 90.8% of its elastic modulus and 92% of its thermal resistance after self-healing at 80 °C for 80 h. An device exhibits efficient heat conduction not only by recovering after gradient compressive strains of up to 30% but also by self-healing its damage or reforming the interface with Cu. Thus, the thermally conductive, self-healing, and elastic composite opens new avenues for smart thermal management in various high-power/intelligent devices.

materials science, multidisciplinary,chemistry, physical
Dry-Contact Thermal Interface Material with the Desired Bond Line Thickness and Ultralow Applied Thermal Resistance

Zhengli Dou,Bin Zhang,Pengfei Xu,Qiang Fu,Kai Wu

DOI: https://doi.org/10.1021/acsami.3c13298

IF: 9.5

2023-11-30

ACS Applied Materials & Interfaces

Abstract:Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport applications, known as thermal interface materials (TIMs), have been impeded by their mediocre applied thermal resistance (R(eff)) in a sandwiched structure. Different from traditional attempts at enhancing thermal conductivity, this study proposes a low-bond line thickness (BLT) path for mitigating the sandwiched thermal impedance. Taking the most common TIM, polydimethylsiloxane/aluminum oxide/zinc...

materials science, multidisciplinary,nanoscience & nanotechnology
Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Kun Huang,Songfeng Pei,Qinwei Wei,Qing Zhang,Jiaqi Guo,Chaoqun Ma,Hui-Ming Cheng,Wencai Ren

DOI: https://doi.org/10.1021/acsnano.4c06952

IF: 17.1

2024-08-18

ACS Nano

Abstract:Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure, and excellent intergraphene contact by manipulating the thermal expansion behavior of scanning centrifugal casted graphene oxide films. The rational design of the AGLF balances the trade-off between the thermal...

materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
Enhancement of thermal conductivity and insulation of silicone thermal interface material through surface modification and synergistic effects of nanofillers for thermal management of electronic devices

Song Shi,Da Zhang,Lansen Bi,Ruixin Ding,Wenshuo Ren,Xinqiao Tang,Yan He

DOI: https://doi.org/10.1016/j.diamond.2024.111064

IF: 3.806

2024-04-08

Diamond and Related Materials

Abstract:Thermal interface materials (TIMs) play an irreplaceable role in highly integrated microelectronic devices. In this work, the addition of acidified carbon nanotubes modified by 3-aminopropyl triethoxysilane (KH550) had an effective enhancement to the thermal conductivity, thermal stability, and electrical insulation performance of silicone grease. On this basis, multi-filled silicone grease composites with better thermal conductivity and electrical insulation were prepared by introducing zinc oxide (ZnO) and Graphene nanoflakes (GNFs). The thermal conductivity of silicone grease achieved 1.438 W m −1 K −1 , while the volume resistivity still exceeded 10 13 Ω·cm. Additionally, the study explored the impact of varying filler parameters, temperature, and contact pressure on the interface thermal contact resistance of silicone grease. The best performance silicone grease applied to the cooling of the high-power LED exhibited excellent heat dissipation. This work presented a reference for the design and development of low cost, high performance TIMs.

materials science, multidisciplinary,physics, applied, condensed matter, coatings & films
Room temperature self-healing and recyclable conductive composites for flexible electronic devices based on imine reversible covalent bond

Jinbiao Min,Zhaoxi Zhou,Hainan Wang,Qihui Chen,Maochun Hong,Heqing Fu

DOI: https://doi.org/10.1016/j.jallcom.2021.162433

IF: 6.2

2022-02-01

Journal of Alloys and Compounds

Abstract:With the development of flexible electronic devices, various requirements for flexible conductive materials have been put forward to. However, the self-healing, mechanical and conductive properties of the flexible materials are poor. Therefore, it is important to prepare self-healing materials with good mechanical and conductive properties. In this paper, room temperature self-healing and conductive composites based on imine reversible covalent bond were prepare by introducing of the carbon nanotube and carbon black. The self-healing, mechanical and conductive properties of the composites were studied. And the structure of the composites was also characterized. The experimental results showed that the mechanical strength and the electrical resistivity of composites were 6.6 MPa and 108 Ω·m, respectively. The composites have excellent room temperature self-healing properties through the reversible exchange of imine bond, and the healing efficiency of mechanical properties and the electrical properties can reach 96% and 93%, respectively. At the same time, the self-healing mechanism was put forward to. In addition, the composites can be recovered by solution recovery and hot pressing.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Multi‐contact Hybrid Thermal Conductive Filler Al2O3@AgNPs Optimized Three‐dimensional Thermal Network for Flexible Thermal Interface Materials

Zhengqiang Huang,Wei Wu,Dietmar Drummer,Chao Liu,Yi Wang,Zhengyi Wang

DOI: https://doi.org/10.1002/app.50889

IF: 3

2021-01-01

Journal of Applied Polymer Science

Abstract:In this work, a multi-contact Al2O3@AgNPs hybrid thermal conductive filler was synthesized by in-situ growth method to fill high thermal conductivity polydimethylsiloxane (PDMS)-based composites to prepare TIMs. And the thermal conductivity, electrical conductivity, and mechanical properties of the composite materials were studied. During the synthesis process of the multi-contact hybrid filler, different concentrations of silver ions were reduced to generate silver nanoparticles and attached to the surface of Al2O3. Al2O3@AgNPs/PDMS thermally conductive composites were prepared by changing the filler addition. Using SEM, XPS, and XRD is used to characterize the morphology and chemical composition of Al2O3@AgNPs hybrid filler. The thermal conductivity of PDMS-based composites with different AgNPs content under 70 wt% filler loading was studied. The results show that the thermal conductivity of PDMS-based composites filled with 7owt%Al2O3@3AgNPs/PDMS multi-contact hybrid filler is 0.67 W/m center dot K, which is 3.72 times that of pure PDMS, and is higher than that of unmodified Al2O3 with the same addition amount. /PDMS composite material has a high thermal conductivity of 24%. This work provides a new idea for the design and manufacture of high thermal conductivity hybrid fillers for TIMs.
Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Junwei Li,Zhenqiang Ye,Pingjing Mo,Yunsong Pang,Enze Gao,Chenxu Zhang,Guoping Du,Rong Sun,Xiaoliang Zeng

DOI: https://doi.org/10.1016/j.compscitech.2023.109948

IF: 9.1

2023-02-06

Composites Science and Technology

Abstract:With the ever-shrinking characteristic dimension of chips and the increasing of packaging density, heat dissipation has become the most critical technology challenge for electronic devices. The development of high-performance thermal interface materials (TIMs) for enhancing thermal coupling and minimizing thermal resistance between heterogeneous components is the key to achieving efficient thermal management of electronic devices. Herein, we report a high-performance carbon fiber/polydimethylsiloxane (CF/PDMS) TIM based on the construction of vertically oriented carbon fiber arrays and the modulation of PDMS's crosslinking density. The resulting CF/PDMS TIM exhibits highly desirable characteristics of through-plane thermal conductivity up to 43.47 W/m∙K (only 20 vol% loading), outstanding elastic compliance similar to soft biological tissues (stress ∼ 35 kPa at 35% compressive strain), and excellent resilience performance (resilience rate of 85% after compression cycles). In addition, the heat dissipation capability of CF/PDMS TIM is improved further by forming interconnected heat-conducting structures on the CF/PDMS TIM's surface. The optimal CF/PDMS TIM in microprocessor cooling application exhibits superior heat dissipation capability and stability during 1000 power cycles, resulting in a 68 °C reduction in the chip temperature compared with the state-of-the-art commercial TIM. This work opens up a new avenue for fabricating high-performance TIMs that meet the heat dissipation requirements of high-performance computing.

materials science, composites

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