Effect of cryogenic temperature on the deformation mechanism of a thin sheet of pure copper at the mesoscale

Peng Zhang,Han Wang,Chuanjie Wang,Qiang Zhu,Gang Chen
DOI: https://doi.org/10.1016/j.msea.2021.141714
2021-01-01
Abstract:To investigate the effect of cryogenic temperature on the deformation mechanism of thin sheets of pure copper, uniaxial tensile experiments were conducted in the present study. The strength and ductility obtained at 77 K are higher than those of the tensile samples deformed at 295 K. Moreover, samples with large grain sizes have a larger ductility enhancement. The kernel average misorientation analysis results suggested that the dislocation density was higher and the dislocation distribution was more homogeneous at 77 K than at 295 K. Based on the model that assumed the grains in the free surface of thin metal sheets as single crystals (surface layer) and the other part of thin metal sheets as a polycrystalline (inner part). A new constitutive model was established to explain the effect of cryogenic temperature on the deformation mechanism of thin sheets of pure copper. The results of this study indicated that micro-plastic forming at the cryogenic temperature was a promising method to enhance the micro-component formability of copper or other similar face-centred cubic (fcc) metals.
What problem does this paper attempt to address?