Correction: Advanced Atomic Layer Deposition Technologies for Micro-LEDs and VCSELs

Yen-Wei Yeh,Su-Hui Lin,Tsung-Chi Hsu,Shouqiang Lai,Po-Tsung Lee,Shui-Yang Lien,Dong-Sing Wuu,Guisen Li,Zhong Chen,Tingzhu Wu,Hao-Chung Kuo
DOI: https://doi.org/10.1186/s11671-022-03664-w
2022-01-01
Nanoscale Research Letters
Abstract:In recent years, the process requirements of nano-devices have led to the gradual reduction in the scale of semiconductor devices, and the consequent non-negligible sidewall defects caused by etching. Since plasma-enhanced chemical vapor deposition can no longer provide sufficient step coverage, the characteristics of atomic layer deposition ALD technology are used to solve this problem. ALD utilizes self-limiting interactions between the precursor gas and the substrate surface. When the reactive gas forms a single layer of chemical adsorbed on the substrate surface, no reaction occurs between them and the growth thickness can be controlled. At the Å level, it can provide good step coverage. In this study, recent research on the ALD passivation on micro-light-emitting diodes and vertical cavity surface emitting lasers was reviewed and compared. Several passivation methods were demonstrated to lead to enhanced light efficiency, reduced leakage, and improved reliability.
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