Method for evaluating fracture toughness of Cu series brittle metal nano multilayer film material

Huang Ping,Zhou Qing,Wang Fei,Xu Kewei
2015-01-01
Abstract:The invention discloses a method for evaluating the fracture toughness of a Cu series brittle metal nano multilayer film material. According to the method, a nanoindentation method is adopted, a laminated thin film test sample is taken as a test sample, and a Berkovich triangular pyramid diamond pressure head is adopted for performing a loading test; after the press-in test is finished, a scanning electron microscope is adopted for observing the indentation morphology, and then the length of a radial crack in the tip of the indentation surface is measured after the loading is finished, and consequently, the fracture toughness of the Cu series brittle metal nano multilayer film material can be calculated. The method is capable of evaluating the fracture toughness of the nano multilayer film simply, conveniently and quickly, and solving the problems of a uniaxial drawing method, such as difficult experimental sample preparation to obtain the nano multilayer thin film, and large errors.
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