SEM in-situ investigation on micro failure characterizations of multi Cu/Ni films under bending loading

Xishu Wang,Jianguo Huang,Xiangkang Meng

2007-01-01

Abstract:The SEM in-situ investigations on the micro interface cracking, propagation and the relationship between the wrinkle failure and the radius of bending for the different Cu/Cu, Cu/Ni multi films were carried out under three points bending. These results indicate that the wrinkle failure model to be similar to a sine waveform first occurs at single layer Cu film when the bending stress is about 148 MPa. With increasing the bending loading, the fracture of film easy occurs at the concavo-convex of wave. However, the cracking from substrate mainly occurs at multi Cu/Ni films when the bending stress is about 130 MPa. But the interface between the Cu/Ni did not find the cracks. Therefore, the resistance of bending failure of single film is greater than that the multi films. The change of damage models such as wrinkle-cracking-detach is mainly depended on the couple about the film layers and matched film materials.